Work

Experimental study of nanoscale Co damascene BEOL interconnect structures

Year: 2016

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc-amc.2016.7507673

Authors: J. Kelly, J. H.-C. Chen, H. Huang, C. K. Hu, E. Liniger, R. Patlolla, B. Peethala, P. Adusumilli, H. Shobha, T. Nogami, T. Spooner, E. Huang, D. Edelstein, D. Canaperi, V. Kamineni, F. Mont, S. Siddiqui

Institutions: IBM Research - Albany, GlobalFoundries (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2467151609

FWCI: 40.08

Cites: 14

Cited by: 63

Related to: 10