Reinforced Solder Preforms for High-Reliability and Low Voiding
Year: 2017
Type: conference-paper
Source: Pan Pacific Symposium
Authors: Tim Jensen, Sunny Neoh, Adam Murling
Institution: Indium Corporation (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2593960176