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Tim Jensen

Observed names: Jensen, Tim, Timothy Jensen
OpenAlex ID: A5113856047
Development, testing, and application of metallic TIMs for harsh environments and non-flat surfaces
2017 · David L. Saums, Tim Jensen · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 6
Influence of reflow profile and Pb-free solder paste in minimizing voids for Quad Flat Pack No-lead (QFN) assembly
2009 · Harish Gadepalli, Rangaraj Dhanasekaran, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
The Basics of Metal Thermal Interface Materials (TIMs)
2020 · Timothy Jensen, Ronald Lasky · Pan Pacific Symposium · 3
Metallic thermal interface material testing and selection for IC, power, and RF semiconductors
2016 · David L. Saums, Tim Jensen · International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) · 3
The Proliferation of Lead-Free Alloys
2009 · Eric Bastow, Timothy Jensen · SMTA International · 3
Testing, Selecting, and Applying Metallic Thermal Interface Materials for Harsh Environment Applications
2017 · David L. Saums, Timothy Jensen · 2
Reinforced Solder Preforms for High-Reliability and Low Voiding
2017 · Tim Jensen, Sunny Neoh, et al. · Pan Pacific Symposium · 2
Metallic TIM testing and selection for Harsh environment applications for GaN RF semiconductors
2016 · Tim Jensen, David L. Saums · IEEE International Symposium on Phased Array Systems and Technology (PAST) · 2
Mechanical Cycling Reliability Testing of Thermal Interface Materials for Semiconductor Test
2019 · David L. Saums, Tim Jensen, et al. · 1
Voiding and Thermal Resistance Modeling and Characterization for a QFN Assembly
2010 · Harish Gadepalli, Rangaraj Dhanasekaran, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 1
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
2026 · Jensen, Tim · Zenodo (CERN European Organization for Nuclear Research)
The Future of Metal Thermal Interface Materials (TIMs)
2024 · Timothy Jensen, Jon Major, et al. · Harsh Environments Conference
Thermal Interface Materials in the HPC Era
2024 · Andy C. Mackie, Tim Jensen, et al. · IMAPSource Proceedings
Gallium: A Versatile Metal with Many Possible Applications
2023 · Tim Jensen, Ron Lasky, et al. · Pan Pacific Symposium
The Future of Metal Thermal Interface Materials
2022 · Ron Lasky, Tim Jensen, et al. · Soldering and Reliability Conferences
The Basics of Metal Thermal Interface Materials (TIMs)
2020 · Timothy Jensen, Ronald Lasky · Pan Pacific Symposium
Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications
2019 · Dave Saums, Tim Jensen, et al. · IMAPSource Proceedings
Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications
2018 · Dave Saums, Tim Jensen, et al. · IMAPSource Proceedings
Reinforced Solder Technology for Increased Reliability
2017 · Tim Jensen, Sunny Neoh, et al. · IMAPSource Proceedings
Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors
2016 · Tim Jensen, David L. Saums · IMAPSource Proceedings
Metallic TIM Testing and Selection for Harsh Environment Applications for GaN RF Semiconductors
2016 · Tim Jensen, David L. Saums · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Process Optimization and Defect Elimination for PCB Assembly
2015 · Tim Jensen · On-Demand Webinars
Advancement of Preform Technology to Reduce QFN Voiding
2014 · Tim Jensen, Seth Homer, et al. · SMTA International
Alloy and Process Optimization for Low AG Solders
2013 · Timothy Jensen, Edward Briggs · SMTA International
Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints Via MN Doping
2013 · Ning-Cheng Lee, Weiping Liu, et al. · Regional Events
Works count: 36
Citation count: 29
H-index: 3
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