Work

Reinforced Solder Technology for Increased Reliability

Year: 2017

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/isom-2017-tha56_167

Authors: Tim Jensen, Sunny Neoh, Adam Murling

Institution: Indium Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2765673299

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