Work

Advancement of Preform Technology to Reduce QFN Voiding

Year: 2014

Type: article

Source: SMTA International

DOI: 10.37665/smyhsbt10329

Authors: Tim Jensen, Seth Homer, Greg Wade

Institution: Indium Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416880596

FWCI:

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