Driving down defect density in composite EUV patterning film stacks
Year: 2017
Type: conference-paper
DOI: 10.1117/12.2260146
Institutions: IBM (United States), Tokyo Electron (Japan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2602145408
