Work

An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering

Year: 2021

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc32696.2021.00228

Authors: Reinhardt Seidel, Marcel Sippel, Jorg Franke

Institution: Friedrich-Alexander-Universität Erlangen-Nürnberg

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Bundesministerium für Wirtschaft und Technologie

OpenAlex ID: W3188097467

FWCI: 1.927

Cites: 9

Cited by: 7

Related to: 10