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Reinhardt Seidel

Observed name: Seidel, Reinhardt
ORCID: 0000-0003-3370-5456
Observed ORCID: 0000-0003-3370-5456
OpenAlex ID: A5080346754
Machine Learning in Production – Potentials, Challenges and Exemplary Applications
2019 · Andreas Mayr, Dominik Kißkalt, et al. · Procedia CIRP · 95
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Development and validation of a digital twin framework for SMT manufacturing
2022 · Reinhardt Seidel, Ben Rachinger, et al. · Computers in Industry · 26
A Machine Learning Based Approach to Detect False Calls in SMT Manufacturing
2020 · Nils Thielen, Dominik Werner, et al. · International Spring Seminar on Electronics Technology · 25
Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks
2020 · Konstantin Schmidt, Nils Thielen, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 22
Trustworthiness of machine learning models in manufacturing applications using the example of electronics manufacturing processes
2022 · Reinhardt Seidel, Konstantin Schmidt, et al. · Procedia CIRP · 11
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Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering
2022 · Reinhardt Seidel, Thomas Ahrens, et al. · Microelectronics Reliability · 10
Towards a Smart Electronics Production Using Machine Learning Techniques
2019 · Reinhardt Seidel, Andreas Mayr, et al. · International Spring Seminar on Electronics Technology · 9
An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering
2021 · Reinhardt Seidel, Marcel Sippel, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Data Mining System Architecture for Industrial Internet of Things in Electronics Production
2020 · Reinhardt Seidel, Hassan Amada, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 7
Impact of THT-hole dimensioning on manufacturability in selective wave soldering
2022 · Reinhardt Seidel, Christopher Kästle, et al. · Microelectronics Reliability · 6
Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors
2020 · Reinhardt Seidel, Nils Thielen, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 6
Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing
2021 · Nils Thielen, Zonghan Jiang, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 5
Comparative Study on Different Methods to Generate Synthetic Data for the Classification of THT Solder Joints
2024 · Nils Thielen, Ben Rachinger, et al. · International Conference on Production Technologies and Systems for E-Mobility (EPTS) · 4
Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression
2020 · Reinhardt Seidel, Fabian Leibold, et al. · International Spring Seminar on Electronics Technology · 4
Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement
2020 · Reinhardt Seidel, Jana Volland, et al. · International Spring Seminar on Electronics Technology · 2
Towards Electronics Reliability Intelligence
2025 · Reinhardt Seidel, David Dudek · SMTA International
2-D Fluid Simulation Approach for Miniwave Soldering
2022 · Reinhardt Seidel, Marcel Sippel, et al. · IEEE Electronic Components and Technology Conference (ECTC)
信頼性のある温度測定のための熱電対付着法に関する実験的研究【jst・京大機械翻訳】
2020 · Reinhardt Seidel, Volland Jana, et al. · IEEE Conference Proceedings
K最近傍を用いた選択波はんだ付けにおけるはんだ付け品質予測のためのデータフレームワークの開発と試験【jst・京大機械翻訳】
2020 · Reinhardt Seidel, Nils Thielen, et al. · IEEE Conference Proceedings
畳込みニューラルネットワークを用いたsmtエレクトロニクス生産におけるはんだ接合のx線検査強化【jst・京大機械翻訳】
2020 · Konstantin Schmidt, Nils Thielen, et al. · IEEE Conference Proceedings
Works count: 21
Citation count: 239
H-index: 7
I10-index: 6
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