Work

Impact of THT-hole dimensioning on manufacturability in selective wave soldering

Year: 2022

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2022.114773

Authors: Reinhardt Seidel, Christopher Kästle, Manuela Ockel, Jörg Franke

Institutions: Friedrich-Alexander-Universität Erlangen-Nürnberg, Siemens (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4297841971

FWCI: 0.272

Cites: 23

Cited by: 6

Related to: 10