Work

2-D Fluid Simulation Approach for Miniwave Soldering

Year: 2022

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51906.2022.00281

Authors: Reinhardt Seidel, Marcel Sippel, Jorg Franke

Institution: Friedrich-Alexander-Universität Erlangen-Nürnberg

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4285103148

FWCI:

Cites: 8

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Related to: 10