Work

A Thin Adhesive for 3D/2.5D Si Chip Stacking at Low Temperature

Year: 2021

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc51362.2021.9537390

Authors: Yasuhisa Kayaba, Yuzo Nakamura, Takashi Kozeki, Jun Kamada, Kazuo Kohmura

Institution: Mitsui Chemicals (Japan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3200577014

FWCI: 1.927

Cites: 7

Cited by: 5

Related to: 10