Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Kazuo Kohmura
Observed name:
K. Kohmura
Institution:
Mitsui Chemicals (Japan)
Observed institutions:
Mitsui Chemicals (Germany),
Association of Super-Advanced Electronics,
Geological Survey of Japan,
Mitsui Chemicals (Japan),
National Institute of Advanced Industrial Science and Technology
OpenAlex ID:
A5075412015
Dissolution of Zeolite in Acidic and Alkaline Aqueous Solutions As Revealed by AFM Imaging
1996
·
Sadaaki Yamamoto
, Shoko Sugiyama
, et al.
·
The Journal of Physical Chemistry
·
75
Effect of moisture adsorption on the properties of porous-silica ultralow-k films
2006
·
Y. Uchida
, S. Hishiya
, et al.
·
Microelectronic Engineering
·
38
Novel organosiloxane vapor annealing process for improving properties of porous low-k films
2006
·
K. Kohmura
, H. Tanaka
, et al.
·
Thin Solid Films
·
28
Influence of Humidity on Electrical Characteristics of Self-Assembled Porous Silica Low-k Films
2005
·
T. Kikkawa
, S. Kuroki
, et al.
·
Journal of The Electrochemical Society
·
27
PDF
Carbon loss induced by plasma beam irradiation in porous silica films
2007
·
K. Kurihara
, T. Ono
, et al.
·
Journal of Applied Physics
·
18
Young’s modulus evaluation by SAWs for porous silica low-k film with cesium doping
2010
·
X. Xiao
, X.M. Shan
, et al.
·
Microelectronic Engineering
·
17
Theoretical Investigation of Dielectric Constant and Elastic Modulus of Three-Dimensional Isotropic Porous Silica Films with Cubic and Disordered Pore Arrangements
2005
·
Hidenori Miyoshi
, Kazuhiro Yamada
, et al.
·
Japanese Journal of Applied Physics
·
17
PDF
A Novel Organosiloxane Vapor Annealing Process for Improving Elastic Modulus of Porous Low-k Films
2004
·
Kazuo Kohmura
, Shunsuke Oike
, et al.
·
MRS Proceedings
·
16
32 nm node Ultralow-k(k=2.1)/Cu Damascene Multilevel Interconnect using High-Porosity (50 %) High-Modulus (9 GPa) Self-Assembled Porous Silica
2007
·
S. Chikaki
, K. Kinoshita
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
12
Effect of Water Adsorption on Electrical Characteristics of Porous Silica Films
2008
·
Yasuhisa Kayaba
, Kazuo Kohmura
, et al.
·
Japanese Journal of Applied Physics
·
11
PDF
Development of a novel closed EUV pellicle for EUVL manufacturing
2016
·
Yosuke Ono
, Kazuo Kohmura
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
9
Cu-Oxide-Assisted Selective Pyrolysis of Organic Nanolayer on Patterned SiO2–Cu Surface
2015
·
Yasuhisa Kayaba
, Shoko Sugiyama Ono
, et al.
·
ACS Applied Materials & Interfaces
·
9
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
2022
·
Keiji Matsumoto
, Takahito Watanabe
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Infrared spectroscopic analysis of siloxane network modification of mesoporous silica film by silylation and cesium doping
2010
·
Yasuhsia Kayaba
, Kazuo Kohmura
, et al.
·
Thin Solid Films
·
7
New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding
2019
·
Yasuhisa Kayaba
, Yuzo Nakamura
, et al.
·
IMAPSource Proceedings
·
6
Electrical Reliabilities of Highly Cross-Linked Porous Silica Film with Cesium Doping
2008
·
Yasuhisa Kayaba
, Kazuo Kohmura
, et al.
·
Journal of The Electrochemical Society
·
6
PDF
Recovery from Plasma-Process-Induced Damage in Porous Silica Low-k Films by Organosiloxane Vapor Annealing
2006
·
Tetsuo Ono
, Keizo Kinoshita
, et al.
·
Japanese Journal of Applied Physics
·
6
PDF
Effect of Plasma Treatment and TMCTS Vapor Annealing on the Reinforcement of Porous low-k Films
2005
·
Kazuo Kohmura
, Hirofumi Tanaka
, et al.
·
MRS Proceedings
·
6
Novel self-assembled ultra-low-k porous silica films with high mechanical strength for 45 nm BEOL technology
2004
·
Y. Oku
, K. Yamada
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
6
A Thin Adhesive for 3D/2.5D Si Chip Stacking at Low Temperature
2021
·
Yasuhisa Kayaba
, Yuzo Nakamura
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
5
Development of closed-type EUV pellicle
2018
·
Yosuke Ono
, Kazuo Kohmura
, et al.
·
Photomask and next-generation lithography mask technology. Conference
·
5
Ultralow-k/Cu Damascene Multilevel Interconnects Using High Porosity and High Modulus Self-Assembled Porous Silica
2010
·
Shinichi Chikaki
, Keizo Kinoshita
, et al.
·
Journal of The Electrochemical Society
·
5
PDF
Removal of etching/ashing residues and ashing/wet-clean damage in porous silica low-k films
2006
·
T. Yamanishi
, T. Ono
, et al.
·
Microelectronic Engineering
·
5
Evaluation of Ultra-thin Layer Fabricated by Wet-process as a Pore-Seal for Porous Low-k Films
2011
·
Shoko Sugiyama Ono
, Kazuo Kohmura
, et al.
·
MRS Proceedings
·
3
Pure Silica Zeolite Films Prepared by a Vapor Phase Transport Method
2008
·
Yoshinori Cho
, Toshiki Seo
, et al.
·
Japanese Journal of Applied Physics
·
3
Show more works
View as search
Works count:
57
Citation count:
380
H-index:
10
I10-index:
10
Year
Topic
Type