Work

Study of Contemporary Electronic Components under a Fluid-Pressure Environment

Year: 1973

Type: article

Source: Defense Technical Information Center (DTIC)

Authors: Harrison, J. W., Wortman, J. J.

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W320490973

FWCI: 0.693

Cites: 12

Cited by: 2

Related to: 10