Thermo-mechanical stress characterization of tungsten-fill through-silicon-via
Year: 2010
Type: conference-paper
Authors: Thuy Dao, Dina H. Triyoso, Rode Mora, Tom Kropewnicki, Brian Griesbach, Doug Booker, Mike Petras, Vance Adams
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4242857346