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超臨界CO$2を用いたCu薄膜堆積における新規還元剤・添加剤の探索

Year: 2005

Type: article

Source: 化学工学会　研究発表講演要旨集

Authors: 智弘大久保, 健百瀬, 正和杉山, 幸浩霜垣

Language: Japanese

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W425890323

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