Work

Suppression of TSV Leakage of Stacking CIS by Optimizing TSV Profile and Uniformity

Year: 2022

Type: conference-paper

Source: China Semiconductor Technology International Conference (CSTIC)

DOI: 10.1109/cstic55103.2022.9856728

Authors: Zherui Cao, Weiwei Yu, Chunshan Zhao, Wuzhi Zhang

Institution: Shanghai Huali Microelectronics (China)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4292829604

FWCI:

Cites: 3

Cited by:

Related to: 10