Work

Multchip SiC-based compact module for automotive applications: A high speed thermal study

Year: 2022

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2022.114700

Authors: L. Anoldo, G. Malta, B. Mazza, G.G. Piccione, M. Calabretta, S. Russo, A. Russo, A. Sitta, A. Messina, A. Lionetto, S. Patanè

Institutions: University of Messina, STMicroelectronics (Italy), Institute for Microelectronics and Microsystems

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: green

Funders: Key Digital Technologies Joint Undertaking, Electronic Components and Systems for European Leadership, Horizon 2020

Award: G2266695045

OpenAlex ID: W4297200722

FWCI: 0.341

Cites: 13

Cited by: 5

Related to: 10