Work

Atomic Diffusion Bonding of Wafers in Air Using Ag-3at%Cu Films

Year: 2023

Type: article

Source: Journal of The Japan Institute of Electronics Packaging

DOI: 10.5104/jiep.jiep-d-23-00072

Authors: Yuki Watabe, Miyuki Uomoto, Takehito Shimatsu

Institutions: Tohoku University, Frontier Research Institute for Interdisciplinary Sciences, Tohoku University, Research Institute of Electrical Communication, Tohoku University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4388016752

FWCI:

Cites: 10

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Related to: 10