Die-First FOPLP Lithography Challenges Due To Die Shifting And A Solution Using Feedforward Adaptive Shot Technology
Year: 2025
Type: article
Abstract: Artificial intelligence (AI) is beginning to have a broad effect on people’s lives. AI can be applied in a variety of ways to a variety of fields, including medicine, sales, finance and more. Market leaders like Intel, AMD, IBM, Microsoft, Meta and Google are using AI in various ways that may ultimately change the future of humankind. AI requires powerful, high-specification chips to speed up the time it takes to train AI models and reduce power consumption. To create AI packages, manufacturers use heterogeneous integration (HI) techniques. Fan-out panel-level packaging (FOPLP), which costs less than other packaging processes, is often employed. Although FOPLP has many advantages, it faces significant process challenges, such as die placement errors and substrate warpage. One of the key challenges is the trade-off between overlay, yield and throughput during the lithography processing steps. A user exposes multiple dies per exposure shot to increase throughput, but this can result in lower overlay yield because of so-called pick-and-place die placement errors. To overcome issues involving low yields, each die needs to be aligned. Doing this impacts throughput, so a compromise is needed. Finding a balancing between throughput and overlay is one of the biggest challenges of FOPLP. In this paper we will address the tradeoff between lithography throughput and overlay yield by demonstrating an integrated feedforward adaptive shot solution. This feedforward approach uses a third-party metrology system to measure reconstituted panel die location data and sends the data to the stepper via a network. With feedforward technology, the stepper uses smart adaptive shot technology to generate an optimized variable shot size layout. This layout ensures overlay yield is within specification and uses the minimum number of exposure steps. With feedforward adaptive shot technology, the user can maximize the throughput of the stepper and ensure proper overlay yield at the same time.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.128402
Authors: John Chang, Jian Lu, Timothy Chang, Keith Best
Institution: Onto Innovation (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4406972205