Work

Verification of Back-to-Front Side Alignment for Advanced Packaging

Year: 2012

Type: conference-paper

Source: Wafer-Level Packaging Symposium

DOI: 10.37665/wannvqm77594

Authors: Warren W. Flack, Manish Ranjan, Gareth Kenyon, Robert Hsieh, John Slabbekoorn, Andy Miller

Institution: IMEC

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416885271

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