eBeam process control for yield and reliability in advanced HBM hybrid bonding
Year: 2026
Type: conference-paper
DOI: 10.1117/12.3093061
Authors: Eran Gal, Shunit Petachia-Halely, Shimon Halevi, Noam Shaham, Sang Jun Jo, Ophir Rosental, David Solomon, Remi Le-Tiec, Masami Himeji, Nitin Singh Malik, Shreyasi Chakraborty, Nitzan Sadot, Chongyang Cai, Yan Li, Liu Jiang, Ravi Dasaka, El Mehdi Bazizi, Jung Min Lee, Kwang Soo Kim, Byeong Kyu Cha, In Young Choi
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7151908323