Work

Through-Silicon via Technology for RF and Millimetre-Wave Applications

Year: 2010

Type: book-chapter

Source: Springer eBooks

DOI: 10.1007/978-1-4419-7276-7_34

Authors: Alvin Joseph, Cheun-Wen Huang, Anthony Stamper, Wayne Woods, Dan Vanslette, Mete Erturk, Jim Dunn, Mike McPartlin, Mark Doherty

Institution: IBM (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W76927101

FWCI:

Cites: 7

Cited by: 2

Related to: 10