Work

Chip‐to‐Wafer and Wafer‐to‐Wafer Integration Schemes

Year: 2008

Type: book-chapter

Source: Wiley eBooks

DOI: 10.1002/9783527623051.ch12

Authors: Thorsten Matthias, Stefan Pargfrieder, Markus Wimplinger, Paul Lindner

Institution: EV Group (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W993605666

FWCI:

Cites: 4

Cited by: 2

Related to: 10