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Steffen Bickel
Observed name:
Bickel, Steffen
Institutions:
Fraunhofer Institute for Reliability and Microintegration,
All Silicon System Integration Dresden
Observed institutions:
Fraunhofer Institute for Reliability and Microintegration,
All Silicon System Integration Dresden,
Technische Universität Dresden
ORCID:
0009-0006-8705-5398
Observed ORCID:
0009-0006-8705-5398
OpenAlex ID:
A5006090288
Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
2017
·
Iuliana Panchenko
, Steffen Bickel
, et al.
·
Japanese Journal of Applied Physics
·
18
Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality
2018
·
Steffen Bickel
, Shawon Sen
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
12
Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration
2024
·
Steffen Bickel
, Sebastian Quednau
, et al.
·
Journal of Electronic Materials
·
10
Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
2018
·
Steffen Bickel
, Robert Hoehne
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
10
Accelerated SLID Bonding for Fine-Pitch Interconnects with Porous Microstructure
2017
·
Jorg Meyer
, Iuliana Panchenko
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D Integration
2022
·
Adil Shehzad
, Ran Yin
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
6
Cu-In-Microbumps for Low-Temperature Bonding of Fine-Pitch-Interconnects
2017
·
Steffen Bickel
, Iuliana Panchenko
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integration
2022
·
Steffen Bickel
, Iuliana Panchenko
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
3
Flux-induced porous structures in Cu-SnAg solidliquid-interdiffusion microbump interconnects
2018
·
Jorg Meyer
, Prathamesh Jayant Upasani
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
3
Enhanced Process Control for Dry Etching of Functional TiN Structures on 300 mm Wafer Level
2024
·
Johann Fell
, Steffen Bickel
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
2
Cu nanowire fine-pitch joints for next gen heterogeneous chiplet integration
2024
·
Steffen Bickel
, Sebastian Quednau
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Low temperature Cu/In bonding for 3D integration
2017
·
Iuliana Panchenko
, Steffen Bickel
, et al.
·
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
·
2
Fine-Pitch Die-to-Wafer Bonding Technologies for Chiplet Integration
2025
·
Juliana Panchenko
, Laura Wenzel
, et al.
·
European Microelectronics and Packaging Conference
·
1
Manufacturing and Reliability Issues of Highly Integrated Packages for Power Electronic Applications
2019
·
Steffen Bickel
, Karsten Meier
, et al.
·
International Spring Seminar on Electronics Technology
·
1
Fundamental investigations of Cu-In based fine-pitch joints for 2.5D/3D system integration
2024
·
Bickel, Steffen
·
Qucosa (Saxon State and University Library Dresden)
Solid-State Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems
2024
·
Steffen Bickel
, Juliana Panchenko
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
Low Temperature Solid State Bonding of Cu-In Fine-Pitch Interconnects
2020
·
Steffen Bickel
, Iuliana Panchenko
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
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Works count:
18
Citation count:
85
H-index:
6
I10-index:
4
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