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Yasuhiro Ibusuki

Mirror-Based Broadband Silicon-Photonics Vertical I/O With Coupling Efficiency Enhancement for Standard Single-Mode Fiber
2020 · Akihiro Noriki, Isao Tamai, et al. · Journal of Lightwave Technology · 28
Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics
2022 · Akihiro Noriki, Isao Tamai, et al. · IEEE Photonics Technology Letters · 23
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Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics
2023 · Akihiro Noriki, Akio Ukita, et al. · Journal of Lightwave Technology · 18
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Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA
2019 · Takahiro NAKAMURA, Kenichiro YASHIKI, et al. · IEICE Transactions on Electronics · 15
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Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors
2020 · A. Noriki, I. Tamai, et al. · European Conference on Optical Communication · 12
Thermal Characteristics of Mirror-Based Optical Redistribution for Co-Packaged Optics
2023 · Fumi Nakamura, Satoshi Suda, et al. · Journal of Lightwave Technology · 10
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High density optical and electrical interfaces for chip-scale silicon photonic receiver
2017 · Koichi Takemura, Yasuhiro Ibusuki, et al. · International Conference on Electronics Packaging (ICEP) · 8
Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate
2021 · T. Amano, A. Noriki, et al. · Optical Fiber Communication Conference · 5
Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror
2019 · Akihiro Noriki, Isao Tamai, et al. · IEEE International D Systems Integration Conference · 5
Advanced devices and packaging of Si-photonics-based optical transceiver for optical interconnection
2017 · K. Kurata, K. Yashiki, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 5
Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging
2021 · S. Suda, T. Kurosu, et al. · Opto-Electronics and Communications Conference (OECC) · 4
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers
2019 · Koichi Takemura, Akio Ukita, et al. · IEEE International D Systems Integration Conference · 4
Analyzing Thermal Tolerance of Mirror-based Optical Redistribution for Co-packaged Optics
2022 · Fumi Nakamura, Satoshi Suda, et al. · Conference on Lasers and Electro-Optics · 3
Key technology developments of active optical package (AOP) substrate for co-packaging of silicon photonics
2020 · Akihiro Noriki, Isao Tamai, et al. · Integrated Photonics Platforms · 3
Chip-scale Si-photonics optical transceiver for a photonics-electronics convergence system
2017 · K. Kurata, K. Yashiki, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Waveguide optical bistable devices with weighted distributed feedback structure
2005 · T. Mizumoto, Y. Ibusuki, et al. · Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) · 2
Demonstration of Thermal Characteristics of 3D Mirror-based Optical Link for Co-packaged Optics
2024 · Fumi Nakamura, Satoshi Suda, et al. · Conference on Lasers and Electro-Optics · 1
Development of optical coupling technologies for Si-photonics-die embedded package substrate
2021 · Akihiro Noriki, Isao Tamai, et al. · 1
Mirror-based silicon-photonics vertical I/O with coupling efficiency enhancement for standard single-mode fiber
2019 · A. Noriki, I. Tamai, et al. · European Conference on Optical Communication · 1
112-Gb/s PAM4 transmission using polymer-waveguide-coupled silicon-photonics for next-generation co-packaged optics
2022 · Satoshi Suda, Takayuki Kurosu, et al. · Organic Photonic Materials and Devices
High-density passive multi-fiber assembly to single-mode polymer waveguides using embedded v-grooves for co-packaged optics
2022 · Tsuyoshi Aoki, Akihiro Noriki, et al.
Co-Packaged Optics Using Polymer Waveguide
2022 · Takeru Amano, Satoshi Suda, et al. · Journal of The Japan Institute of Electronics Packaging
Optical and electrical interconnect structures for chip-scale silicon photonic transceivers (Conference Presentation)
2018 · Koichi Takemura, Yasuhiro Ibusuki, et al.
1.48μm Pump-LD用波長安定化ファイバグレーティング
1998 · Yasuhiro Ibusuki, Toshiaki Tsuda, et al. · Technical report of IEICE. OPE
Waveguide optical bistable device with distributed reflectors
1994 · Testuya Mizumoto, Yasuhiro Ibusuki, et al.
Works count: 26
Citation count: 150
H-index: 7
I10-index: 6
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