Author

Tatsuo Migita

Observed names: T Migita, T. Migita, Tatsuo MIGITA

Institution: Toshiba (Japan)

Observed institutions: Toshiba (Japan), Hiroshima Institute of Technology, Tokyo University of Agriculture and Technology

OpenAlex ID: A5009284780

Effect of dc bias on the compositional ratio of WNX thin films prepared by rf-dc coupled magnetron sputtering

2001 · T. Migita, R. Kamei, et al. · Applied Surface Science · 26

Microstructure and electrical properties of CoNX thin films deposited by unbalanced magnetron sputtering

2001 · H Asahara, T Migita, et al. · Vacuum · 25

Transient and Stationary Characteristics of Thermally Induced Ultrasonic Emission from Nanocrystalline Porous Silicon

2002 · Tatsuo Migita, Hiroyuki Shinoda, et al. · Japanese Journal of Applied Physics · 22

Effect of DC bias voltage on the deposition rate for Ni thin films by RF–DC coupled unbalanced-magnetron sputtering

2000 · Y. Mikami, K. Yamada, et al. · Surface and Coatings Technology · 22

Effect of d.c. bias on the deposition rate using r.f.–d.c. coupled magnetron sputtering for SnNx thin films

2000 · R Kamei, T Migita, et al. · Vacuum · 18

Multifunctional properties of nanocrystalline porous silicon as a quantum-confined material

2002 · N Koshida, A Kojima, et al. · Materials Science and Engineering C · 11

Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM

2012 · Hirokazu Ezawa, Takashi Togasaki, et al. · Microelectronic Engineering · 6

Flip chip interconnects qualified for advanced low-k chips with SnCu bumps by alloying Cu/Sn plated stack

2008 · H. Ezawa, M. Uchida, et al. · Electronic System-Integration Technology Conference (ESTC) · 5

Process integration of fine pitch micro-bumping and Cu redistribution wiring for power efficient SiP

2010 · Hirokazu Ezawa, Takashi Togasaki, et al. · Electronic System-Integration Technology Conference (ESTC) · 4

Intensifying Thermally Induced Ultrasound Emission

2002 · N. Asamura, U. K. Saman Keerthi, et al. · 4

Mid-end Process Technologies for Advanced Packaging of LSI Devices

2012 · Hiroaki Ezawa, Masaya Shima, et al. · Journal of Photopolymer Science and Technology · 3

Low-k Interconnect Oriented Lead Free Sn-Cu Bump Process Integration with Sn/Cu Stack Plating

2026 · Tadashi Iijima, Tatsuo Migita, et al. · IMAPSource Proceedings

Photon, Electron and Utlrasonic Emission from Nanocrystalline Porous Silicon Devices

2002 · N. Koshida, B. Gelloz, et al. · MRS Proceedings

Transient and Stationary Characteristics of Thermally Induced Ultrasonic Emission from Nanocrystalline Porous Silicon

2001 · Tatsuo Migita, Hiroyuki Shinoda, et al. · International Conference on Solid State Devices and Materials (SSDM)

Preparation of WNx Thin Films Using RF-DC Coupled Magnetron Sputtering and Diffusion Barrier Properties for Cu/WNx/Si Samples.

2000 · Tatsuo MIGITA, Takeshi TANAKA, et al. · Shinku

Preparation of SnNx Thin Films Using RF-DC Coupled Magnetron Sputtering.

1999 · Ryuuzou KAMEI, Tatsuo MIGITA, et al. · Shinku

Preparation of MgNx Thin Films using RF-DC Coupled Magnetron Sputtering in Ar-N2 Gas.

1998 · Tatsuo MIGITA, Ryuuzou KAMEI, et al. · Shinku

Works count: 17

Citation count: 146

H-index: 6

I10-index: 6