Author

Verena Hein

Observed names: Hein, Verena, V. Hein

Institution: X-Fab (Germany)

Observed institution: X-Fab (Germany)

ORCID: 0000-0003-4604-1484

Observed ORCID: 0000-0003-4604-1484

OpenAlex ID: A5010305873

A design for robust wide metal tracks

2012 · M. Ackermann, V. Hein, et al. · Microelectronics Reliability · 12

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization

2016 · Verena Hein, Marco Erstling, et al. · Microelectronics Reliability · 11

Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks

2017 · Raj Sekar Sethu, Verena Hein, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 8

Reliability performance of different layouts of wide metal tracks

2014 · Jorg Kludt, Kirsten Weide-Zaage, et al. · IEEE International Reliability Physics Symposium proceedings · 8

Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs

2005 · K. Weide-Zaage, V. Hein · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects

2013 · Aymen Moujbani, Jörg Kludt, et al. · Microelectronics Reliability · 6

Simulation of the influence of TiAl3 layers on the thermal–electrical and mechanical behaviour of Al metallizations

2012 · J. Kludt, K. Weide-Zaage, et al. · Microelectronics Reliability · 6

“New Automotive” – Considerations for Reliability, Robustness and Resilience For CMOS Interconnects

2018 · Kirsten Weide-Zaage, Helene Fremont, et al. · Pan Pacific Symposium · 5

Life time characterization for a highly robust metallization

2015 · K. Weide-Zaage, Kludt, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5

Deformation of octahedron slotted metal tracks

2013 · Jorg Kludt, Kirsten Weide-Zaage, et al. · IEEE International Integrated Reliability Workshop final report · 5

Characterization of a new designed octahedron slotted metal track by simulations

2013 · J. Kludt, K. Weide-Zaage, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5

Differences in reliability effects for thick copper and thick aluminium metallizations

2017 · Martin Pohl, Marco Erstling, et al. · IEEE International Reliability Physics Symposium proceedings · 3

A Design for Highly Robust AlCu - W-Plug - Metallization Stack

2016 · V. Hein, M. Ackermann, et al. · Pan Pacific Symposium · 3

Dynamic simulation of octahedron slotted metal structures

2013 · J. Kludt, K. Weide-Zaage, et al. · Microelectronics Reliability · 3

Process, Geometry and Stack Related Reliability Of Thick Alcu-Metal-Tracks

2018 · Kirsten Weide-Zaage, Verena Hein · Pan Pacific Symposium · 2

Degradation behavior in upstream/downstream via test structures

2014 · J. Kludt, K. Weide-Zaage, et al. · Microelectronics Reliability · 2

Overlap design for higher tungsten via robustness in AlCu metallizations

2013 · Jorg Kludt, Kirsten Weide-Zaage, et al. · IEEE International Integrated Reliability Workshop final report · 2

Investigation of temperature gradients with regard to thermomigration in aluminium metallizations

2013 · J. Kludt, K. Weide-Zaage, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2

Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications

2012 · M. Ackermann, V. Hein, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2

ALCU-metal heater for interconnect monitoring test structures

2016 · Verena Hein, Marco Erstling · Pan Pacific Symposium · 1

Evaluation new corner stress relief structure layout for high robust metallization

2014 · V. Hein, J. Kludt, et al. · Microelectronics Reliability · 1

The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications

2024 · Verena Hein, Kirsten Weide-Zaage, et al. · Pan Pacific Symposium

Advanced Analysis and Monitoring of Failure Mechanisms in Microelectronics Metallization

2024 · André Clausner, Matthias Kraatz, et al. · Pan Pacific Symposium

Advanced Analysis and Monitoring of Failure Mechanism Thin as well as Thick Microelectronics Metallization Structures

2024 · André Clausner, Matthias Kraatz, et al. · Pan Pacific Symposium

The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications

2024 · Verena Hein, Kirsten Weide-Zaage, et al. · Pan Pacific Symposium

Works count: 36

Citation count: 99

H-index: 6

I10-index: 2