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Masahide Goto
Observed names:
Goto, Masahide,
M. GOTO,
M. Goto,
Msahide Goto
Institution:
Japan Broadcasting Corporation (Japan)
Observed institutions:
Japan Broadcasting Corporation (Japan),
Japan Radio Co., Ltd. (Japan),
Institute of Industrial Science, The University of Tokyo,
The University of Tokyo
ORCID:
0000-0002-1388-4488
Observed ORCID:
0000-0002-1388-4488
OpenAlex ID:
A5017726683
Electret charging method based on soft X-ray photoionization for MEMS transducers
2012
·
Kei Hagiwara
, Masahide Goto
, et al.
·
IEEE Transactions on Dielectrics and Electrical Insulation
·
70
High-Performance Condenser Microphone With Single-Crystalline Silicon Diaphragm and Backplate
2007
·
Masahide Goto
, Yoshinori Iguchi
, et al.
·
IEEE Sensors Journal
·
42
Quarter Video Graphics Array Digital Pixel Image Sensing With a Linear and Wide- Dynamic-Range Response by Using Pixel-Wise 3-D Integration
2018
·
Masahide Goto
, Yuki Honda
, et al.
·
IEEE Transactions on Electron Devices
·
31
Three-dimensional integrated CMOS image sensors with pixel-parallel A/D converters fabricated by direct bonding of SOI layers
2014
·
Masahide Goto
, Kei Hagiwara
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
29
Silicon microphone with wide frequency range and high linearity
2006
·
Yoshinori Iguchi
, Masahide Goto
, et al.
·
Sensors and Actuators A Physical
·
28
Soft X-ray Charging Method for a Silicon Electret Condenser Microphone
2010
·
Kei Hagiwara
, Masahide Goto
, et al.
·
Applied Physics Express
·
27
PDF
Grating-based in-line geometric-phase-shifting incoherent digital holographic system toward 3D videography
2022
·
Teruyoshi Nobukawa
, Yutaro Katano
, et al.
·
Optics Express
·
22
Pixel-Parallel 3-D Integrated CMOS Image Sensors With Pulse Frequency Modulation A/D Converters Developed by Direct Bonding of SOI Layers
2015
·
Masahide Goto
, Kei Hagiwara
, et al.
·
IEEE Transactions on Electron Devices
·
22
3-D Silicon-on-Insulator Integrated Circuits With NFET and PFET on Separate Layers Using Au/SiO2Hybrid Bonding
2014
·
Masahide Goto
, Kei Hagiwara
, et al.
·
IEEE Transactions on Electron Devices
·
21
Novel Through-substrate Charging Method for Electret Generator Using Soft X-ray Irradiation
2009
·
K. Hagiwara
, Makoto Honzumi
, et al.
·
18
Incoherent digital holography simulation based on scalar diffraction theory
2021
·
Teruyoshi Nobukawa
, Yutaro Katano
, et al.
·
Journal of the Optical Society of America A
·
16
Fabrication of Micromechanical Tunneling Probes and Actuators on a Silicon Chip
1999
·
Hiroshi Toshiyoshi
, Masahide Goto
, et al.
·
Japanese Journal of Applied Physics
·
13
3-Layer Stacking Technology with Pixel-Wise Interconnections for Image Sensors Using Hybrid Bonding of Silicon-on-Insulator Wafers Mediated by Thin Si Layers
2022
·
Masahide Goto
, Yuki Honda
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Coherence aperture restricted spatial resolution for an arbitrary depth plane in incoherent digital holography
2021
·
Teruyoshi Nobukawa
, Yutaro Katano
, et al.
·
Applied Optics
·
11
Pixel-Parallel Three-Layer Stacked CMOS Image Sensors Using Double-Sided Hybrid Bonding of SOI Wafers
2023
·
Masahide Goto
, Yuki Honda
, et al.
·
IEEE Transactions on Electron Devices
·
10
New signal readout method for ultrahigh-sensitivity CMOS image sensor
2003
·
T. Watabe
, M. Goto
, et al.
·
IEEE Transactions on Electron Devices
·
10
Single-shot incoherent digital holography based on generalised three-step phase-shifting method with 1D phase grating
2025
·
Teruyoshi Nobukawa
, Masahiro Usui
, et al.
·
Scientific Reports
·
9
New fabrication process for high-performance silicon condenser microphone with monocrystalline silicon diaphragm and backplate
2004
·
Y. Iguchi
, T. Tajima
, et al.
·
IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
·
9
Transformation of coherence-dependent bokeh for incoherent digital holography
2022
·
Teruyoshi Nobukawa
, Momoko Maezawa
, et al.
·
Optics Letters
·
8
Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration
2018
·
Masahide Goto
, Yuki Honda
, et al.
·
IEEE International Symposium on Circuits and Systems proceedings
·
8
3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers
2022
·
Masahide Goto
, Yuki Honda
, et al.
·
Electronic Imaging
·
7
PDF
128 × 96 Pixel-parallel three-dimensional integrated CMOS image sensors with 16-bit A/D converters: By direct bonding with embedded Au electrodes
2015
·
Masahide Goto
, Kei Hagiwara
, et al.
·
IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
·
7
A novel MOSFET with vertical signal-transfer capability for 3D-structured CMOS image sensors
2014
·
Masahide Goto
, Kei Hagiwara
, et al.
·
IEEJ Transactions on Electrical and Electronic Engineering
·
7
Epitaxial growth and properties of MnAs/GaAs/MnAs trilayer heterostructures
1999
·
M. Tanaka
, K. Saito
, et al.
·
Journal of Magnetism and Magnetic Materials
·
7
In-pixel A/D converters with 120-dB dynamic range using event-driven correlated double sampling for stacked SOI image sensors
2016
·
Masahide Goto
, Yuki Honda
, et al.
·
IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
·
6
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Works count:
111
Citation count:
524
H-index:
12
I10-index:
16
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