Author

Paul Kettner

Observed names: Kettner, P., P Kettner, P. Kettner

Institution: EV Group (Austria)

Observed institutions: EV Group (Austria), Brewer Science (United States)

OpenAlex ID: A5018235345

Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers

2008 · Stefan Pargfrieder, Paul Kettner, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 47

New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications

2006 · P Kettner, R L Pelzer, et al. · Journal of Physics Conference Series · 26

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New technologies for advanced high density 3D packaging by using TSV process

2008 · Paul Kettner, Bioh Kim, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 15

Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications

2006 · R. Pelzer, H. Kirchberger, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 15

Thin wafer handling and processing-results achieved and upcoming tasks in the field of 3D and TSV

2009 · Paul Kettner, Jurgen Burggraf, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 8

Comparison of Enabling Wafer Bonding Techniques for TSV Integration

2010 · Bioh Kim, Thorsten Matthias, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 7

Thin wafer processing - yield enhancement through integrated metrology

2011 · Thorsten Matthias, Daniel Burgstaller, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5

Nanoimprint lithography: full wafer replication of nanometer features

2005 · Rainer Pelzer, Cecile Gourgon, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5

Advanced low temperature bonding technologies

2004 · R. Pelzer, V. Dragoi, et al. · IEEE International Conference on Semiconductor Electronics · 4

Cu-Cu Thermo-Compression Bonding for TSV Integration

2010 · Bioh Kim, Thorsten Matthias, et al. · ECS Transactions · 3

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Advanced chip to wafer bonding: A flip chip to wafer bonding technology for high volume 3DIC production providing lowest cost of ownership

2009 · A. Sigl, S. Pargfrieder, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Advances in spray coating technologies for MEMS, 3DICs and additional applications

2011 · Eric F Pabo, Hirokazu Kurotaki, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Nanoimprinting — a Key Enabling Technology for BioM EMS and Biomedical Applications

2004 · R. Eichinger-Heue, T. Glinsner, et al. · Springer eBooks · 2

Low temperature packaging of BioMEMS and Lab-on-chip devices

2011 · Thorsten Matthias, Ron Miller, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1

Processes for the Integration of MEMS and CMOS

2010 · E.F. Pabo, T. Matthias, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1

Lowest cost of ownership for chip to wafer bonding with the advanced chip to wafer bonding process flow

2009 · A. Sigl, T. Glinsner, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1

Throughput Enhanced Flip-Chip to Wafer Bonding: The Advanced Chip to Wafer Bonding

2009 · Alfred Sigl, Stefan Pargfrieder, et al. · ECS Transactions · 1

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Transition From MEMS Technology to Nanofabrication

2007 · T. Glinsner, P. Lindner, et al. · First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B · 1

Temperature Reduced Direct Bonding By Plasma Assisted Wafer Surface Pre-Treatment

2006 · R. Pelzer, V. Dragoi, et al. · Electronic Packaging Technology Conference · 1

Application of imprint technologies for creation of micro- and nanoscale pattern

2004 · Thomas Glinsner, Michael Beutl, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1

Advances in lithography technologies for wafer-level packaging

2003 · R. Pelzer, P. Kettner, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Vertical 3D interconnect through aligned wafer bonding

2003 · R. Peizer, T. Mafthias, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Low Temperature Bonding with Thin Wafers for 3D Integration

2011 · Thorsten Matthias, Bioh Kim, et al. · ECS Transactions

Advanced Wafer-to-Wafer and Chip-to-Wafer Bonding for 3D Integration

2008 · Bioh Kim, Paul Kettner, et al. · 한국표면공학회 학술발표회 초록집

Nanoimprint lithography - a next generation high volume lithography technique

2004 · Pelzer, R., Lindner, P., et al. · HAL

Works count: 25

Citation count: 151

H-index: 6

I10-index: 4