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Bernd Roelfs

Observed names: B. Roelfs, Roelfs Bernd
Institution: Atotech (Germany)
OpenAlex ID: A5018893808
Adsorption of Thymine on Gold Single-Crystal Electrodes
1997 · B. Roelfs, E. Bunge, et al. · The Journal of Physical Chemistry B · 104
In-situ infrared spectroscopic studies of thymine adsorption on a Au(111) electrode
1998 · Wolfgang Haiss, Bernd Roelfs, et al. · Journal of Electroanalytical Chemistry · 59
Structure and Dynamics of Tetramethylthiourea Adsorption on Au(111) Studied by in Situ Scanning Tunneling Microscopy
1996 · E. Bunge, R. J. Nichols, et al. · Langmuir · 39
Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes
2012 · Bernd Roelfs, Nina Dambrowsky, et al. · Circuit World · 35
The interaction of dimethylsulfoxide with a gold surface
1997 · C. Schröter, B. Roelfs, et al. · Surface Science · 30
Adsorption and Film Formation of Thymine on a Gold (100) Single Crystal Electrode
1995 · B. Roelfs, H. Baumgärtel · Berichte der Bunsengesellschaft für physikalische Chemie · 27
Adsorbate-Induced Etching of Au(111) Surfaces: A Combined in-Situ Infrared Spectroscopy and Scanning Tunneling Microscopy Study
1997 · E. Bunge, S. N. Port, et al. · Langmuir · 26
A Capacitance and Infrared Study of the Electrical Double Layer Structure at Single Crystal Gold Electrodes in Acetonitrile
1995 · E. Panzram, H. Baumgärtel, et al. · Berichte der Bunsengesellschaft für physikalische Chemie · 19
A comparison of metal/vacuum and metal/electrolyte interfaces : The Au(100)/(dimethylsulfoxide) and (dimethylsulfoxide + acetonitrile) systems
1997 · B. Roelfs, C. Schröter, et al. · Berichte der Bunsengesellschaft für physikalische Chemie · 12
A comprehensive packaging solution for next generation IC substrates
2011 · Stephen Kenny, Dave Baron, et al. · European Microelectronics and Packaging Conference · 3
Simultaneous front and back side Cu metallization on power chips
2017 · Cassandra Melvin, Bernd Roelfs · International Convention on Information and Communication Technology, Electronics and Microelectronics · 2
Simultaneous front and back side Cu metallization on power chips: DP: Discrete and power devices or ET/ID: Enabling technologies and innovative devices
2017 · Cassandra Melvin, Bernd Roelfs · ASMC proceedings · 2
Electrolytic solder deposit for next generation flip chip solder bumping: 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference
2010 · Stephen Kenny, Bernd Roelfs, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
Electrolytic solder deposit for next generation flip chip solder bumping
2010 · Bernd Roelfs, Stephen Kenny, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
MultiPlate- from wafer to panel-new solutions for electrolytic cu deposition in advanced packaging
2016 · Robin Taylor, Bernd Roelfs, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
High Aspect Ratio Package Core Production with Electrolytic Deposited Copper
2010 · Stephen Kenny, Bernd Roelfs · IMAPSource Proceedings · 1
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From thin cores to outer layers: Filling through holes and blind micro vias with copper by reverse pulse plating
2009 · Stephen Kenny, Bernd Roelfs · International Conference on Electronic Packaging Technology (ICEPT) · 1
A Method towards Infinite Bath Life for Acid Copper Electrolytes
2003 · Akif Özkök, Bernd Roelfs, et al. · 1
The role of impurities on the reliability of Cu interconnects - A challenge for advanced packaging solutions
2019 · Thomas Beck, Bernd Roelfs · International Workshop on Junction Technology
Electroless deposition of Nickel-Palladium-Gold for high reliability and power application: Cost and performance progress
2016 · Bernd Roelfs · IEEE/CPMT International Electronics Manufacturing Technology Symposium
先端パッケージングの電解Cu堆積のためのウエハパネル新しい解へのMultiPlate from【Powered by NICT】
2016 · Taylor Robin, Roelfs Bernd, et al. · IEEE Conference Proceedings
New Challenges For Higher Aspect Ratio: Filling Through Holes And Blind Micro Vias With Copper By Reverse Pulse Plating
2011 · Bernd Roelfs, Nina Dambrowsky, et al. · SMTA International
Electrolytic Solder Deposition for IC-Substrates: From Deposition Uniformity to Solder Ball Geometry
2011 · Bernd Roelfs, Kai Matejat · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
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Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping
2010 · Stephen Kenny, Sven Lamprecht, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
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The Smaller the Better - Simultaneous Electrolytic Solder Deposition on Both Sides of a Fine-Pitch Package Substrate
2009 · Sven Lamprecht, Hugh Roberts, et al. · SMTA International
Works count: 27
Citation count: 366
H-index: 9
I10-index: 9
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