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Alice Guerrero

Observed names: A. Guerrero, Alice F. Guerrero, Guerrero, Alice
ORCID: 0009-0000-2177-8581
Observed ORCID: 0009-0000-2177-8581
OpenAlex ID: A5019420703
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding
2012 · A. Phommahaxay, A. Jourdain, et al. · IEEE International D Systems Integration Conference · 35
Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
2020 · Koen Kennes, Alain Phommahaxay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 31
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics
2019 · Alain Phommahaxay, Gerald Beyer, et al. · International Wafer Level Packaging Conference (IWLPC) · 24
Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications
2013 · Anne Jourdain, Alain Phommahaxay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23
Acoustic modulation during laser debonding of collective hybrid bonded dies
2021 · Koen Kennes, Alain Phommahaxay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 17
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material
2016 · Alain Phommahaxay, Goedele Potoms, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 17
Carrier Systems for Collective Die-to-Wafer Bonding
2022 · Koen Kennes, Alain Phommahaxay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up
2019 · Arnita Podpod, Alain Phommahaxay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift
2019 · Arnita Podpod, Andy Miller, et al. · International Wafer Level Packaging Conference (IWLPC) · 9
Single-release-layer process for temporary bonding applications in the 3D integration area
2015 · Anne Jourdain, Alain Phommahaxay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9
Process characterization of thin wafer debonding with thermoplastic materials
2012 · Alain Phommahaxay, Anne Jourdain, et al. · Electronic System-Integration Technology Conference (ESTC) · 9
Evaluation of wet-developable KrF organic BARC to improve CD uniformity for implant application
2004 · Isabelle D. Guilmeau, Alice F. Guerrero, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9
Multi-tier die stacking through collective die-to-wafer hybrid bonding
2024 · Koen Kennes, Ye Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up
2018 · Alain Phommahaxay, Arnita Podpod, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
2023 · Koen Kennes, Alice Guerrero, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer
2017 · Alain Phommahaxay, Anne Jourdain, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Wet-Developable Organic Anti-Reflective Coatings For Implant Layer Applications
2004 · Xie Shao, Alice Guerrero, et al. · 6
Temporary bonding for High-topography Applications: Spin-on Material Versus Dry Film
2014 · Anne Jourdain, Alain Phommahaxay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift
2025 · Tiffany Tang, Alice Guerrero, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Developer soluble organic BARCs for KrF lithography
2003 · Chris Cox, Darron F. Dippel, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Prevention of thinned wafer deformation during thermocompression bonding and multi-die stacking supported by temporary bonding materials
2021 · Alice Guerrero, Pieter Bex, et al. · International Symposium on Microelectronics · 2
Photoresist-induced development behavior in DBARCs
2010 · Jim D. Meador, Alice Guerrero, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Improving the Wafer Thinning Flow Robustness for 2.5D & 3D Applications
2024 · Nader Jedidi, Koen Kennes, et al. · Electronic System-Integration Technology Conference (ESTC) · 1
Thin cleanable organic laser release layer with ultralow laser transmittance below 360 nm wavelength for TBDB
2026 · Hanlin Chen, Loyde Braidlow, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Direct Die-to-Wafer Bonding on Thin Interposers: Wafer Reconstruction and Back Side Nano-Topography Evaluation
2025 · Nader Jedidi, Koen Kennes, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
Works count: 32
Citation count: 260
H-index: 9
I10-index: 8
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