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David Lai

Observed names: David S. W. Lai, David S.W. Lai, Lai, David, Lai, David S.W.
ORCID: 0000-0002-9989-1485
Observed ORCID: 0000-0002-9989-1485
OpenAlex ID: A5020450266
A tabu search heuristic for the heterogeneous vehicle routing problem on a multigraph
2016 · David S.W. Lai, Ozgun Caliskan Demirag, et al. · Transportation Research Part E Logistics and Transportation Review · 131
Efficient Neighborhood Evaluations for the Vehicle Routing Problem with Multiple Time Windows
2020 · Maaike Hoogeboom, Wout Dullaert, et al. · Transportation Science · 43
A simulation–optimization approach for a service-constrained multi-echelon distribution network
2018 · Marije Noordhoek, Wout Dullaert, et al. · Transportation Research Part E Logistics and Transportation Review · 36
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Real-time rescheduling and disruption management for public transit
2017 · David S. W. Lai, Janny M. Y. Leung · Transportmetrica B Transport Dynamics · 34
An Exact Algorithm for a Rich Vehicle Routing Problem with Private Fleet and Common Carrier
2019 · Said Dabia, David Lai, et al. · Transportation Science · 24
Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration
2021 · Jay Lia, Fang-Lin Tsai, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 22
Electrical Performances of Fan-Out Embedded Bridge
2021 · JinWei You, Jay Li, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 22
The Optimal Solution of Fan-Out Embedded Bridge (FO-EB) Package Evaluation during the Process and Reliability Test
2022 · Vito Lin, David Lai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 16
A graph-based formulation for the shift rostering problem
2019 · David S.W. Lai, Janny M.Y. Leung, et al. · European Journal of Operational Research · 11
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The Pollution-Routing Problem with Speed Optimization and Uneven Topography
2021 · Lai, David, Costa, Yasel, et al. · ePrints Soton (University of Southampton) · 7
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Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application
2022 · Po Yu Liao, Ian Ho, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Warpage Assessment of Chip Module in Chip Last FO-MCM Platform for Non-wetting Risk Evaluation
2020 · George Pan, Nicholas Kao, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 5
TIM Coverage Evaluation for High Performance Computing Application
2022 · Shane Lin, Ken Zhang, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 4
Enhance Larger FCBGA Package Evaluation and Characterization
2019 · Vito Lin, Nicholas Kao, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 4
Warpage and Stress Simulation Analysis of Substrate on Substrate Antenna in Package (AiP) for 5G CPE Application
2022 · Ken Zhang, Vito Lin, et al. · International Conference on Electronics Packaging (ICEP) · 3
Warpage Simulation Study by Trace Mapping Method for FCCSP with ETS Substrate
2021 · Ken Zhang, Nicholas Kao, et al. · International Symposium on Microelectronics · 2
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FCCSP(MUF) Mold-flow Void Risk Prediction with Different Substrate Surface and Bump Height Design
2021 · Freedman Yen, Nicholas Kao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
High performance FCBGA Package Evaluation and Characterization for the Networking Application
2021 · Vito Lin, Nicholas Kao, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Flip Chip Assembly on Coreless Substrate Challenge with Die Bond Solution
2019 · James Su, Yu Po Wang, et al. · European Microelectronics and Packaging Conference · 2
Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application
2021 · Ming-Han Zhuang, Teny Shih, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1
An Exact Method to Solve the Multi-Trip 2-Echelon Vehicle Routing Problem with Porters
2026 · Suheyb Erdemci, Antonio Martinez-Sykora, et al. · SSRN Electronic Journal
A New Dual-Band Resonator in Measuring Dielectric Constant at 5G Frequency Band and Yagi Antenna Implemented
2024 · Chia-Chu Lai, Ho-Chuan Lin, et al. · IMAPSource Proceedings
Material Impact With Package Solution for 5g Rf Application
2021 · POYUAN SU, Yu-Po Wang, et al.
High Performance Computing Package With Chip Module on Substrate Solutions
2021 · Ching Chia Chen, Vito Lin, et al.
High Performance Computing Package With Chip Module on Substrate Solutions
2021 · Ching Chia Chen, Vito Lin, et al.
Works count: 33
Citation count: 376
H-index: 9
I10-index: 9
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