Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Sung-Uk Zhang
Observed names:
S U Zhang,
S.U. Zhang,
Sung Uk Zhang,
Zhang Sung-Uk
Institution:
Dong-Eui University
Observed institutions:
Kumoh National Institute of Technology,
Dong-Eui University,
University of Florida,
Samsung Electronics (South Korea),
Ulsan National Institute of Science and Technology
ORCID:
0000-0003-2328-175X
Observed ORCID:
0000-0003-2328-175X
OpenAlex ID:
A5022027739
Noise analysis in magnetic resonance electrical impedance tomography at 3 and 11 T field strengths
2005
·
Rosalind Sadleir
, Samuel Grant
, et al.
·
Physiological Measurement
·
92
PDF
Temperature-dependent mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing
2017
·
Sung-Uk Zhang
, Jonghyeuk Han
, et al.
·
International Journal of Precision Engineering and Manufacturing
·
46
Fatigue life evaluation of wire bonds in LED packages using numerical analysis
2014
·
Sung-Uk Zhang
, Bang Weon Lee
·
Microelectronics Reliability
·
38
Degradation Classification of 3D Printing Thermoplastics Using Fourier Transform Infrared Spectroscopy and Artificial Neural Networks
2018
·
Sung-Uk Zhang
·
Applied Sciences
·
29
PDF
High field MREIT: setup and tissue phantom imaging at 11 T
2006
·
Rosalind Sadleir
, Samuel Grant
, et al.
·
Physiological Measurement
·
26
PDF
Infill Print Parameters for Mechanical Properties of 3D Printed PLA Parts
2018
·
Kyoung-SU Seol
, Panxi Zhao
, et al.
·
Journal of the Korean Society of Manufacturing Process Engineers
·
25
Imaging and quantification of anomaly volume using an eight-electrode ‘hemiarray’ EIT reconstruction method
2008
·
R J Sadleir
, S U Zhang
, et al.
·
Physiological Measurement
·
20
PDF
Classifying Thermal Degradation of Polylactic Acid by Using Machine Learning Algorithms Trained on Fourier Transform Infrared Spectroscopy Data
2020
·
Sung-Uk Zhang
·
Applied Sciences
·
16
PDF
3D Bioprinting for Tissue Engineering
2017
·
Sujin Noh
, Noehyun Myung
, et al.
·
Springer eBooks
·
16
Fatigue Test of 3D-printed ABS Parts Fabricated by Fused Deposition Modeling
2018
·
Kyoung-Su Seol
, Byoung-Chul Shin
, et al.
·
Journal of the Korean Society of Manufacturing Process Engineers
·
14
Progress of Near-Infrared-Based Medical Imaging and Cancer Cell Suppressors
2022
·
Vicky Mudeng
, Gelan Ayana
, et al.
·
Chemosensors
·
11
PDF
Quantification of silicone degradation for LED packages using finite element analysis
2015
·
Sung-Uk Zhang
·
Microelectronics Reliability
·
11
Magnetostatic Analysis Using Implicit Boundary Finite-Element Method
2010
·
Sung-Uk Zhang
, Ashok V. Kumar
·
IEEE Transactions on Magnetics
·
11
Classifying Degraded Three-Dimensionally Printed Polylactic Acid Specimens Using Artificial Neural Networks based on Fourier Transform Infrared Spectroscopy
2019
·
Sung-Uk Zhang
·
Applied Sciences
·
9
PDF
Three-Dimensional Magnetostatic Analysis Using Structured Mesh and Nodal Elements
2010
·
Sung-Uk Zhang
, Ashok V. Kumar
·
IEEE Transactions on Magnetics
·
9
Numerical evaluation of ABS parts fabricated by fused deposition modeling and vapor smoothing
2017
·
Sung-Uk Zhang
·
Advances in Science Technology and Engineering Systems Journal
·
8
Thermo-mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing
2017
·
Sung-Uk Zhang
, Jonghyeuk Han
, et al.
·
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
·
6
Chip package interaction for LED packages
2016
·
Sung-Uk Zhang
·
Microelectronics Reliability
·
5
Recognition of adherent polychaetes on oysters and scallops using Microsoft Azure Custom Vision
2023
·
Dong-hyeon Kim
, Se-woon Choe
, et al.
·
Electronic Research Archive
·
4
PDF
Design-Oriented Degradation Mapping and Hyperelastic Model-Switch Guidelines for Nitrile-Butadiene Rubber Seals
2025
·
Na-Yeon Choi
, Dong-Seok Kim
, et al.
·
Polymers
·
3
PDF
A Benchmarking Study on IGBT Thermal-Electrical Performance Using Finite Element Analysis and Design of Experiments (DOE)
2025
·
Na-Yeon Choi
, Dong-Hyeon Kim
, et al.
·
Journal of Electrical Engineering and Technology
·
3
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method
2023
·
Na-Yeon Choi
, Sung-Uk Zhang
·
Microelectronics Reliability
·
3
Numerical Evaluation of Thermal Resistance for Power MOSFET Packaged in Hermetic Method
2022
·
Na-Yeon Choi
, Sung-Uk Zhang
·
Journal of Electrical Engineering and Technology
·
3
A Comparative Study of the Linear-elastic and Hyperelastic Models for Degradation of PLA Prepared using Fused Filament Fabrication
2020
·
Na-Yeon Choi
, Byoung-Chul Shin
, et al.
·
Journal of the Korean Society of Manufacturing Process Engineers
·
3
Inverse Method for Estimating Resistivity of Carbon Fiber Composite Structures
2010
·
Sung-Uk Zhang
, Ashok V. Kumar
·
Journal of Engineering Materials and Technology
·
3
Show more works
View as search
Works count:
53
Citation count:
436
H-index:
11
I10-index:
13
Year
Topic
Type
