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Akio Ukita

5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF
2015 · Kenichiro Yashiki, Yasuyuki Suzuki, et al. · Optical Fiber Communication Conference · 46
Mirror-Based Broadband Silicon-Photonics Vertical I/O With Coupling Efficiency Enhancement for Standard Single-Mode Fiber
2020 · Akihiro Noriki, Isao Tamai, et al. · Journal of Lightwave Technology · 28
125-µm-pitch × 12-channel “optical pin” array as I/O structure for novel miniaturized optical transceiver chips
2015 · Toshinori Uemura, Akio Ukita, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 27
Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics
2022 · Akihiro Noriki, Isao Tamai, et al. · IEEE Photonics Technology Letters · 23
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Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform
2022 · Koichi Takemura, Daisuke Ohshima, et al. · Transactions of The Japan Institute of Electronics Packaging · 21
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Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics
2023 · Akihiro Noriki, Akio Ukita, et al. · Journal of Lightwave Technology · 18
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1.2 Tbps/cm2 Enabling Silicon Photonics IC Technology Based on 40-nm Generation Platform
2018 · Tohru Mogami, Akio Ukita, et al. · Journal of Lightwave Technology · 16
Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA
2019 · Takahiro NAKAMURA, Kenichiro YASHIKI, et al. · IEICE Transactions on Electronics · 15
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Chip-scale packaging of hybrid-integrated Si photonic transceiver: Optical I/O core
2015 · Koichi Takemura, Mitsuru Kurihara, et al. · IEEE CPMT Symposium Japan (ICSJ) · 15
Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors
2020 · A. Noriki, I. Tamai, et al. · European Conference on Optical Communication · 12
Thermal Characteristics of Mirror-Based Optical Redistribution for Co-Packaged Optics
2023 · Fumi Nakamura, Satoshi Suda, et al. · Journal of Lightwave Technology · 10
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High density optical and electrical interfaces for chip-scale silicon photonic receiver
2017 · Koichi Takemura, Yasuhiro Ibusuki, et al. · International Conference on Electronics Packaging (ICEP) · 8
Silicon-Photonics-Embedded Interposers and Their Applications
2021 · Koichi Takemura, Daisuke Ohshima, et al. · International Conference on Electronics Packaging (ICEP) · 7
Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate
2021 · T. Amano, A. Noriki, et al. · Optical Fiber Communication Conference · 5
Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror
2019 · Akihiro Noriki, Isao Tamai, et al. · IEEE International D Systems Integration Conference · 5
Advanced devices and packaging of Si-photonics-based optical transceiver for optical interconnection
2017 · K. Kurata, K. Yashiki, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 5
Evaluation of optical coupling characteristics for optoelectronic hybrid LSI package
2016 · A. Noriki, T. Amano, et al. · IEEE CPMT Symposium Japan (ICSJ) · 5
Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging
2021 · S. Suda, T. Kurosu, et al. · Opto-Electronics and Communications Conference (OECC) · 4
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers
2019 · Koichi Takemura, Akio Ukita, et al. · IEEE International D Systems Integration Conference · 4
Analyzing Thermal Tolerance of Mirror-based Optical Redistribution for Co-packaged Optics
2022 · Fumi Nakamura, Satoshi Suda, et al. · Conference on Lasers and Electro-Optics · 3
Key technology developments of active optical package (AOP) substrate for co-packaging of silicon photonics
2020 · Akihiro Noriki, Isao Tamai, et al. · Integrated Photonics Platforms · 3
Automated tuning of an electronic circuit board using the artificial neural network approach
1996 · Akio Ukita, Waldemar Karwowski, et al. · Journal of Intelligent Manufacturing · 3
A modulation package tuning machine applying fuzzy logic
2005 · Akio Ukita, Toshio Kitagawa · Springer eBooks · 2
Development of optical coupling technologies for Si-photonics-die embedded package substrate
2021 · Akihiro Noriki, Isao Tamai, et al. · 1
Mirror-based silicon-photonics vertical I/O with coupling efficiency enhancement for standard single-mode fiber
2019 · A. Noriki, I. Tamai, et al. · European Conference on Optical Communication · 1
Works count: 30
Citation count: 288
H-index: 10
I10-index: 11
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