Author

Abigail L. Dudek

Observed names: Abigail Dudek, Abigail L Dudek

Institution: Lewis University

Observed institution: Lewis University

ORCID: 0000-0002-5911-3312

Observed ORCID: 0000-0002-5911-3312

OpenAlex ID: A5024188549

Role of Molecular Structure on Modulating the Interfacial Dynamics for Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Applications

2021 · Katherine M. Wortman-Otto, Abigail N. Linhart, et al. · ECS Journal of Solid State Science and Technology · 15

Strategic Design of Antimicrobial Hydrogels Containing Biomimetic Additives for Enhanced Matrix Responsiveness and HDFa Wound Healing Rates

2020 · Abigail N. Linhart, Katherine M. Wortman-Otto, et al. · ACS Applied Bio Materials · 7

Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes

2022 · Kiana A. Cahue, Abigail L. Dudek, et al. · ECS Transactions · 6

Utilizing an α,β-Unsaturated Dicarboxylic Acid for a Defect Initiated Residue Removal During Cu post-Chemical Mechanical Planarization Cleaning

2022 · Abigail L. Dudek, Kiana A. Cahue, et al. · ECS Journal of Solid State Science and Technology · 2

Development of Slurry Formulations for Molybdenum-Chemical Mechanical Planarization (Mo-CMP)

2022 · Abigail L. Dudek, Jason J. Keleher · ECS Meeting Abstracts · 2

Effect of Structure to Promote Organic Residue Removal during Cu Post-Chemical Mechanical Planarization (p-CMP) Cleaning

2023 · Abigail L. Dudek, Adam T. Caridi, et al. · ECS Meeting Abstracts · 1

(Invited) Design of Reduced Shear Force Cu Cleaning Processes Via α-β-Unsaturated Chemistries for Enhanced BTA Residue Removal

2024 · Adam T. Caridi, Abigail Dudek, et al. · ECS Meeting Abstracts

Utilization of an α,β-Unsaturated Carboxylic Acid to Employ an “over Cutting” Mechanism for Defect Mitigation during Cu Post-Chemical Mechanical Planarization (p-CMP) Cleaning

2022 · Abigail L. Dudek, Kiana A. Cahue, et al. · ECS Meeting Abstracts

Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes

2022 · Kiana A. Cahue, Abigail L. Dudek, et al. · ECS Meeting Abstracts

(Invited) Synergistic Effect of Polyvinyl Alcohol (PVA) Brush Type and Cleaning Chemistry Formulation for Copper (Cu) Post-Chemical Mechanical Planarization (p-CMP) Cleaning

2021 · Jason J. Keleher, Abigail L Dudek, et al. · ECS Meeting Abstracts

Works count: 10

Citation count: 33

H-index: 3

I10-index: 1