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Tzung-Hua Ying

Observed name: T. H. Ying
OpenAlex ID: A5026572567
HPGe detector absolute-peak-efficiency calibration by using the ESOLAN program
1995 · Tien-Ko Wang, Wei-Yang Mar, et al. · Applied Radiation and Isotopes · 39
Challenges of 29nm half-pitch NAND Flash STI patterning with 193nm dry lithography and self-aligned double patterning
2008 · M. C. Chiu, Benjamin Szu-Min Lin, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 15
The influence of amorphous TaNx under-layer on the crystal growth of over-deposited Ta film
2016 · Wei-Lin Wang, Wei-Chun Chen, et al. · Thin Solid Films · 14
The Reliability Improvement of Cu Interconnection by the Control of Crystallized α‐Ta/TaN x Diffusion Barrier
2015 · Wei-Lin Wang, Chia-Ti Wang, et al. · Journal of Nanomaterials · 14
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The contact resistance reduction of Cu interconnects by optimizing the crystal behavior of Ta/TaN diffusion barrier
2014 · Wei-Lin Wang, Kuo-Tzu Peng, et al. · Materials Science in Semiconductor Processing · 10
Impact of Moisture From Passivation on Endurance and Retention of NAND Flash Memory
2012 · Zih-Song Wang, Te-Yuan Yin, et al. · IEEE Transactions on Electron Devices · 8
A composite model for LELE process
2025 · Devin Sima, Wenzhang Li, et al. · International Workshop on Advanced Patterning Solutions (IWAPS) · 2
Wet Chemical Etching Behavior Investigation for CMOS Shallow Trench Isolation (STI) Shape Control
2016 · Hsin Tai, Po-Cheng Chang, et al. · ECS Transactions · 2
A case study on inline defect diagnosis by applying e-beam inspection system
2016 · Hao-Yu Chien, Chan-Hao Hsu, et al. · ASMC proceedings · 2
Novel Clean Concept of Advanced Patterning Film (Amorphous Carbon) for Beyond 2xnm Generation Self-Aligned Double-Patterning (SADP) Process
2014 · Hsin Tai, Yu-Mei Liao, et al. · ECS Transactions · 2
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A co-optimization flow to expanding PWQ through HSF and model-based loading effect for DRAM LELE metal layer
2025 · Tatsi Iao, Fengnien Tsai, et al. · International Workshop on Advanced Patterning Solutions (IWAPS) · 1
Thermal Budget Reduction in Triple Gate Oxide Process by Wet Etch Technique
2017 · Hsin Tai, Hsin-Yi Liao, et al. · ECS Meeting Abstracts · 1
Novel Poly Gate Shaping by Wet Etch Process in 2xnm NAND Flash Device and Beyond
2014 · Yu-Mei Liao, Hsin Tai, et al. · ECS Transactions · 1
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A comprehensive intra-CD uniformity control through optimizing pattern loading effect correction by AI-trained model
2025 · Yingxiong Guo, Wenzhang Li, et al. · International Workshop on Advanced Patterning Solutions (IWAPS)
Thermal Budget Reduction in Triple Gate Oxide Process by Wet Etch Technique
2017 · Hsin Tai, Hsin-Yi Liao, et al. · ECS Transactions
The defect reduction of Cu interconnects by optimized Cu seed layer
2016 · Shi-Jun Liu, Wei-Lin Wang, et al. · International Symposium on Next-Generation Electronics
The effects of plating current and rotation speed on the microstructural properties of electrochemical plated Cu films
2016 · Wei-Lin Wang, Shi-Jun Liu, et al. · International Symposium on Next-Generation Electronics
Wet Chemical Etching Behavior Investigation for CMOS Shallow Trench Isolation (STI) Shape Control
2016 · Hsin Tai, Po-Cheng Chang, et al. · ECS Meeting Abstracts
The integration process of W-plug landing on Cu line in 28nm-node flash memory and beyond
2015 · Yi-Wen Lu, Wei-Lin Wang, et al. · International Symposium on Next-Generation Electronics
Novel Clean Concept of Advanced Patterning Film (Amorphous Carbon) for Beyond 2xnm Generation Self-Aligned Double-Patterning (SADP) Process
2014 · Hsin Tai, Yu-Mei Liao, et al. · ECS Meeting Abstracts
Novel Poly Gate Shaping by Wet Etch Process in 2xnm NAND Flash Device and Beyond
2014 · Yu-Mei Liao, Hsin Tai, et al. · ECS Meeting Abstracts
Analysis of P-Doped Polycrystalline Silicon Missing of W-Polycide Gate for 2X nm NAND Flash
2013 · Chun-Chi Chen, Wen-Chung Yang, et al. · Japanese Journal of Applied Physics
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Works count: 22
Citation count: 111
H-index: 6
I10-index: 5
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