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Mu-Hsuan Chan

X-ray photoelectron spectroscopy analyses of titanium oxynitride films prepared by magnetron sputtering using air/Ar mixtures
2009 · Mu-Hsuan Chan, Fu-Hsing Lu · Thin Solid Films · 86
Preparation of titanium oxynitride thin films by reactive sputtering using air/Ar mixtures
2008 · Mu-Hsuan Chan, Fu-Hsing Lu · Surface and Coatings Technology · 62
Characterization of N-doped TiO2 films prepared by reactive sputtering using air/Ar mixtures
2009 · Mu-Hsuan Chan, Fu-Hsing Lu · Thin Solid Films · 47
Preparation of ZrNxOy films by magnetron sputtering using air as a reactive gas
2010 · Mu-Hsuan Chan, Po-Lun Wu, et al. · Thin Solid Films · 36
Air-based deposition and processing windows of sputtered TiN, TiNxOy, and N-doped TiOx thin films
2012 · Mu-Hsuan Chan, Fu-Hsing Lu · Surface and Coatings Technology · 25
Characterization of Cr-doped TiO2 thin films prepared by cathodic arc plasma deposition
2007 · Mu-Hsuan Chan, Wei-Yu Ho, et al. · Surface and Coatings Technology · 22
Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration
2021 · Jay Lia, Fang-Lin Tsai, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 21
Air-Based Deposition of Conductive Nitride Thin Films by Sputtering
2011 · Mu-Hsuan Chan, Fu-Hsing Lu · Journal of The Electrochemical Society · 21
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Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections
2011 · Chien-Feng Chan, Wen-Tsung Tseng, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 13
Characteristics of chromium-doped titanium oxide coatings synthesized by cathodic arc deposition
2008 · Wei-Yu Ho, Mu-Hsuan Chan, et al. · Thin Solid Films · 10
Influences of oxygen impurity contained in nitrogen on the reaction of titanium with nitrogen
2009 · Fu-Hsing Lu, Bor-Feng Jiang, et al. · Journal of materials research/Pratt's guide to venture capital sources · 8
Effects of cleaning process on the reliability of ultra-fine gap for 3D package
2015 · Mu-Hsuan Chan, Brock Hsue, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package
2013 · Mu-Hsuan Chan, Yi-Chian Liao, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
A study on the 3DIC interconnection using thermal compression bond with non conductive paste process
2012 · Mu-Hsuan Chan, Huei-Nuan Huang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 5
Underfill adhesion enhancement via optimization of plasma treatment for 3DIC
2013 · Chi-Tung Yeh, Huei-Nuan Huang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 4
Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology
2016 · Mu-Hsuan Chan, Yu-Po Wang, et al. · IMAPSource Proceedings · 1
Heat-resistance study of thermal release tape
2013 · Chieh-Yuan Chi, Chun-Tang Lin, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
High thermal conductivity underfill study for fine pitch Cu pillar bump
2013 · Huei-Nuan Huang, Mei-Chin Lee, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Effective 3DIC chip module warpage with UF design by analytical method
2013 · Pai-Yuan Lee, Chi-Tung Yeh, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Reliability of thermal compression bond combine with non conductive paste process in fine pitch micro-bumps soldering
2011 · Chien-Feng Chan, Wen-Tsung Tseng, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Preparation of Titanium Oxide Coatings Synthesized by Cathodic Arc Deposition
2008 · Wei-Yu Ho, Mu-Hsuan Chan, et al.
Works count: 22
Citation count: 375
H-index: 10
I10-index: 10
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