Author

Yi-Wun Wang

Observed names: Y. W. Wang, Y.W. Wang, YiWun Wang

Institutions: Tamkang University, National Taipei University of Technology

Observed institutions: Tamkang University, National Taipei University of Technology, National Taiwan University, National Tsing Hua University

ORCID: 0000-0003-1154-7725

Observed ORCID: 0000-0003-1154-7725

OpenAlex ID: A5028497530

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

2008 · Y.W. Wang, Y.W. Lin, et al. · Journal of Alloys and Compounds · 194

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

2008 · Y.W. Wang, Y.W. Lin, et al. · Microelectronics Reliability · 108

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

2009 · C.C. Chang, Y.W. Lin, et al. · Journal of Alloys and Compounds · 103

Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

2008 · Y.W. Wang, C.C. Chang, et al. · Journal of Alloys and Compounds · 90

Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding

2010 · Jiunn Chen, Yi-Shao Lai, et al. · Microelectronics Reliability · 56

Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders

2009 · Y.W. Wang, Y.W. Lin, et al. · Journal of Alloys and Compounds · 41

Phase formation and microstructure evolution in Cu/In/Cu joints

2019 · Y.S. Chiu, H.Y. Yu, et al. · Microelectronics Reliability · 30

Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems

2010 · M.Y. Tsai, S.C. Yang, et al. · Journal of Alloys and Compounds · 27

Materials Merging Mechanism of Microfluidic Electroless Interconnection Process

2018 · S. Yang, H. T. Hung, et al. · Journal of The Electrochemical Society · 26

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Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu

2008 · S.C. Yang, Y.W. Wang, et al. · Journal of Electronic Materials · 20

Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications

2018 · Y.W. Wang, T.L. Yang, et al. · Journal of Alloys and Compounds · 19

Phase stabilities and interfacial reactions of the Cu–In binary systems

2020 · Y. F. Lin, H. T. Hung, et al. · Journal of Materials Science Materials in Electronics · 17

Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions

2023 · Yi-Wun Wang, Hua-Tui Liang, et al. · Journal of Electronic Materials · 16

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Mechanical characterizations of single-crystalline (Cu, Ni)6Sn5 through uniaxial micro-compression

2019 · J.Y. Wu, Y.S. Chiu, et al. · Materials Science and Engineering A · 16

Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder

2008 · S.C. Yang, W.C. Chang, et al. · Journal of Electronic Materials · 15

Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints

2021 · Y.W. Wang · Materials Chemistry and Physics · 14

Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples

2019 · Y.W. Wang, Z.X. Zhu, et al. · Journal of Alloys and Compounds · 14

Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications

2018 · Y. W. Wang, W. L. Shih, et al. · Journal of Electronic Materials · 13

Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints

2018 · T. H. Yang, H. Y. Yu, et al. · Journal of Electronic Materials · 12

Tuning Electrospray Ionization with Low-Frequency Sound

2022 · Yi-Wun Wang, Gurpur Rakesh D. Prabhu, et al. · Journal of the American Society for Mass Spectrometry · 10

Enhancing the Permeate Flux Improvement of Direct Contact Membrane Distillation Modules with Inserted S-Ribs Carbon-Fiber Filaments

2024 · Chii-Dong Ho, Yi-Wun Wang, et al. · Membranes · 8

Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints

2010 · C. C. Chang, Y. W. Wang, et al. · Journal of Electronic Materials · 8

Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects

2023 · Yi-Wun Wang, Tzu-Ting Tseng, et al. · Journal of the Taiwan Institute of Chemical Engineers · 7

Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints

2022 · Y. W. Wang, G. W. Wu, et al. · Journal of Materials Science Materials in Electronics · 7

Improved stability and film formability of oil-based silver nanoparticle suspensions by addition of polystyrene

2022 · Yi-Wun Wang, Ting-Hui Yang, et al. · Materials Chemistry and Physics · 7

Works count: 43

Citation count: 915

H-index: 15

I10-index: 20