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Kei Murayama

Studies on electrical performance and thermal stress of a silicon interposer with TSVs
2010 · Masahiro Sunohara, Hideaki Sakaguchi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 55
Warpage control of silicon interposer for 2.5D package application
2013 · Kei Murayama, Mitsuhiro Aizawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 45
Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package
2020 · Kei Murayama, Shota Miki, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 33
Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm)
2009 · Masahiro Sunohara, Akinori Shiraishi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 28
Development of interconnect technologies for embedded organic packages
2004 · M. Sunohara, K. Murayama, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
Electro-migration behavior in low temperature flip chip bonding
2012 · Kei Murayama, Mitsutoshi Higashi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
Study of Crystal Orientation and Microstructure in Sn-Bi and Sn-Ag-Cu Solder with Thermal Compression Bonding and Mass Reflow
2016 · Kei Murayama, Mitsuhiro Aizawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Electro-migration Behavior in Eutectic Sn-Bi Flip Chip Solder Joints with Cu-Pillar Electrodes
2013 · Kei MURAYAMA, Takashi KURIHARA, et al. · Journal of Smart Processing · 12
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Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post Bumps
2011 · Kei Murayama, Taiji Sakai, et al. · IMAPSource Proceedings · 12
Electromigration in tin-bismuth planar solder joints
2023 · Prabjit Singh, L. Palmer, et al. · International Conference on Electronics Packaging (ICEP) · 11
Study of electro-migration resistivity of micro bump using SnBi solder
2014 · Kei Murayama, Mitsuhiro Aizawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
Low stress bonding for large size die application
2015 · Kei Murayama, Mitsuhiro Aizawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
150 GHz-Band Compact Phased-Array AiP Module for XR Applications Toward 6G
2025 · Yohei Morishita, Ken Takahashi, et al. · IEEE Microwave and Wireless Technology Letters · 9
A 150 GHz High-Power-Density Phased-Array Transceiver in 65nm CMOS for 6G UE Module
2025 · Yudai Yamazaki, Sunghwan Park, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 8
Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects
2012 · Ken Miyairi, Masahiro Sunohara, et al. · IMAPSource Proceedings · 7
Electromigration in Tin-bismuth Planar Solder Joints
2024 · Prabjit Singh, Larry Palmer, et al. · Transactions of The Japan Institute of Electronics Packaging · 5
Silver sintering technology based on induction heating for chip level bonding
2021 · Christian Hofmann, Mario Baum, et al. · IEEE CPMT Symposium Japan (ICSJ) · 5
Voids Inspection Capability Study in First-Level Interconnects for Flip Chip Packages
2021 · Masahiro Tsuriya, Kor Oon Lee, et al. · International Conference on Electronics Packaging (ICEP) · 5
Development of High Reliability Joint of Sn-Bi Solder for 2.3D Organic Package
2021 · Shota Miki, Koyuki Kawakami, et al. · International Conference on Electronics Packaging (ICEP) · 5
Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints
2024 · Prabjit Singh, L. Palmer, et al. · Journal of Surface Mount Technology · 4
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Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints
2024 · P. Singh, L. Palmer, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
In Situ Study of Electromigration in Eutectic Tin-Bismuth Planar Solder Joints
2024 · Prabjit Singh, L. Palmer, et al. · Pan Pacific Symposium · 4
Evaluation of Half-Bridge Power Module with POL-kW
2021 · Shingo Hayashibe, Kei Murayama, et al. · IEEE CPMT Symposium Japan (ICSJ) · 4
Effect of crystal anisotropy and IMCs on electromigration resistivity of low temperature flip chip interconnect
2021 · Kei Murayama, Mitsuhiro Aizawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Effects of Au and Pd in Pad Surface Finish on Electro-Migration of Flip Chip Interconnection Between Cu-Pillar and Sn-Bi Solder Alloy System
2018 · Kei Murayama, Mitsuhiro Aizawa, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Works count: 63
Citation count: 376
H-index: 11
I10-index: 12
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