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Aelan Mosden
Observed name:
A. Mosden
Observed institutions:
Tokyo Electron (Japan),
Center for Nanoscale Science and Technology,
Onto Innovation (United States)
OpenAlex ID:
A5036374490
A Novel Dry Selective Etch of SiGe for the Enablement of High Performance Logic Stacked Gate-All-Around NanoSheet Devices
2019
·
N. Loubet
, S. Kal
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
112
Deep learning acceleration in 14nm CMOS compatible ReRAM array: device, material and algorithm co-optimization
2022
·
N. Gong
, M.J. Rasch
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
25
Nondestructive characterization of nanoscale subsurface features fabricated by selective etching of multilayered nanowire test structures using Mueller matrix spectroscopic ellipsometry based scatterometry
2020
·
Madhulika Korde
, Subhadeep Kal
, et al.
·
Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena
·
23
Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors
2021
·
Curtis Durfee
, Subhadeep Kal
, et al.
·
ECS Transactions
·
17
PDF
Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
2020
·
Ashim Dutta
, Jennifer Church
, et al.
·
SPIE Conference on Extreme Ultraviolet (EUV) Lithography
·
13
X-Ray metrology of nanowire/ nanosheet FETs for advanced technology nodes
2020
·
Madhulika S. Korde
, Joseph Kline
, et al.
·
Metrology, Inspection, and Process Control XXXVI
·
9
Resistive Memory Process Optimization for High Resistance Switching Toward Scalable Analog Compute Technology for Deep Learning
2021
·
Y. Kim
, S.-C. Seo
, et al.
·
IEEE Electron Device Letters
·
8
Demonstration of transfer learning using 14 nm technology analog ReRAM array
2024
·
Fabia Farlin Athena
, Omobayode Fagbohungbe
, et al.
·
Frontiers in Electronics
·
6
PDF
Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes
2019
·
Madhulika S. Korde
, Subhadeep Kal
, et al.
·
Metrology, Inspection, and Process Control XXXVI
·
6
Effect of rare gas addition on deep trench silicon etch
2004
·
Siddhartha Panda
, Richard Wise
, et al.
·
Microelectronic Engineering
·
6
Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures
2022
·
John M. Papalia
, Devi Koty
, et al.
·
Advanced Etch Technology and Process Integration for Nanopatterning
·
3
Highly selective isotropic chemical dry etching for gate-all-around devices: nanosheet, forksheet and complementary FETs
2022
·
Yusuke Muraki
, Yusuke Oniki
, et al.
·
Advanced Etch Technology and Process Integration for Nanopatterning
·
2
Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors
2021
·
Curtis Durfee
, Subhadeep Kal
, et al.
·
ECS Meeting Abstracts
·
2
Scatterometry of nanowire/ nanosheet FETs for advanced technology nodes
2021
·
Madhulika Korde
, Subhadeep Kal
, et al.
·
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
·
2
Enabling complimentary FET (CFET) fabrication: selective, isotropic etch of Group IV semiconductors (Conference Presentation)
2019
·
Subhadeep Kal
, Yusuke Oniki
, et al.
·
Advanced Etch Technology and Process Integration for Nanopatterning
·
2
Dry-plasma-free chemical etch technique for variability reduction in multi-patterning (Conference Presentation)
2017
·
Subhadeep Kal
, Nihar Mohanty
, et al.
·
2
Study of surface interactions for encapsulation of phase change memory materials
2022
·
Luxherta Buzi
, Devi Koty
, et al.
·
Advanced Etch Technology and Process Integration for Nanopatterning
Isotropic plasma free Si trim for FinFET to GAA device architectures (Conference Presentation)
2020
·
Subhadeep Kal
, Yusuke Oniki
, et al.
·
Advanced Etch Technology and Process Integration for Nanopatterning
Highly selective dry-plasma-free chemical etch technique for advanced patterning
2017
·
Subhadeep Kal
, Nihar Mohanty
, et al.
·
SPIE Newsroom
Non-Plasma Based Atomic Layer Dry Removal Technology for 10nm Node and Beyond
2016
·
Yongzhuo Su
, Tomoki Suemasa
, et al.
·
ECS Meeting Abstracts
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Works count:
20
Citation count:
238
H-index:
7
I10-index:
5
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