2003 · Kenji Monden · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 2

High Thermal Conducting Composites Using Percolation Theory

2017 · Kenji Monden · The minerals, metals & materials series · 1

Investigation on the Thermal Conductivity of Resin Composite Materials

2014 · Kenji Monden · Wiley eBooks · 1

Effect of percolation on equivalent thermal conductivity of insulating layer in insulated metal substrates

2002 · Kenji Monden · Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu · 1

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Development of New Backwashing Air Amplifying Device for Bag Filter

2015 · Ryo Ebisuzaki, Eijiro Mukai, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE)

Optical Evaluation for Biomimetic Microlens Array on PDMS Sheet

2015 · Kenji Monden · Wiley eBooks

Optical Evaluation for Biomimetic Microlens Array on PDMS Sheet

2015 · Kenji Monden · Springer eBooks

Improvement of Reverse Air Amplifying System for Bag Filter

2014 · Ryo Ebisuzaki, Eijiro Mukai, et al. · Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu

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Investigation on the Thermal Conductivity of Inorganic‐Filler/Resin Composite

2013 · Kenji Monden · Wiley eBooks

2904 Development of New Reverse Air Amplifying Device for Bagfilter

2013 · Ryo Ebisuzaki, Eijiro Mukai, et al. · Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu

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Comparison of Creep Life Assessment between Tin-Based Lead-Free Solders and Lead Solders

2012 · Kenji Monden · John Wiley & Sons, Inc. eBooks

Influence of Nano-fillers on Initial Trees in Epoxy/Silica Nanocomposite

2011 · Jiandong Wu, Tomonori Izuka, et al. · 電気学会研究会資料. ED, 放電研究会

J0601-3-5 A Study of the Cooling Method of SiC Package by FEM Analysis

2010 · Kenji Monden · The proceedings of the JSME annual meeting

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Reliability Improvement of Solder Joints Between Ceramic Chip Resistors and Insulated Metal Substrates With Thick Copper Pads

2005 · Kenji Monden · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

High reliable and thermally conductive stack for high-power module in HEV

2002 · M. Ibukiyama, K. Monden, et al. · IEEE International Vehicle Electronics Conference (IVEC)

E213 Research of Electric Device Cooling Using the Benchmark Model : Heat Generation Model of Silicon Chip

2001 · Kenji Monden · The Proceedings of the Thermal Engineering Conference

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自転車編座談会「自転車に乗ること、それが制作研究へと繋がる路程」

· 塩澄, 祥大, 志村, 翔太, et al. · Institutional Repositories DataBase (IRDB)

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Works count: 25

Citation count: 99

H-index: 5

I10-index: 4