Get started
Author

P. Roumanille

From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue
2021 · E. Ben Romdhane, P. Roumanille, et al. · Microelectronics Reliability · 35
PDF
Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging
2021 · Pierre Roumanille, Emna Ben Romdhane, et al. · Microelectronics Reliability · 28
Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components
2020 · E. Ben Romdhane, A. Guédon-Gracia, et al. · Microelectronics Reliability · 24
PDF
Bi 2 (C 2 O 4 ) 3 ·7H 2 O and Bi(C 2 O 4 )OH Oxalates Thermal Decomposition Revisited. Formation of Nanoparticles with a Lower Melting Point than Bulk Bismuth
2017 · Pierre Roumanille, Valérie Baco-Carles, et al. · Inorganic Chemistry · 20
PDF
Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling
2021 · E. Ben Romdhane, P. Roumanille, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
Using X-ray imaging for the study of crack development in solder reliability testing
2023 · P. Roumanille, J. Lesseur, et al. · Microelectronics Reliability · 8
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
2022 · E. Ben Romdhane, P. Roumanille, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7
QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
2022 · E. Ben Romdhane, P. Roumanille, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
New LGT crystal for ultra-stable resonators
2014 · J J Boy, M. Allani, et al. · European Frequency and Time Forum · 5
Enhancement of the piezoelectric effect in Fe-substituted GaAsO4: A combined XRD, Raman spectroscopy and first principles study
2020 · D. Zheng, P. Roumanille, et al. · Solid State Sciences · 2
Matériaux d'assemblage basse température pour applications électroniques : de l'intérêt des oxalates et formiates de métaux
2018 · Pierre Roumanille · theses.fr (ABES)
Developing new joining materials for low-temperature electronics assembly
2016 · P. Roumanille, V. Baco, et al. · IEEE Nanotechnology Materials and Devices Conference (NMDC)
PDF
Matériaux innovants sans plomb pour l'assemblage de composants électroniques à basse température
2016 · P. Roumanille, Valérie Baco-Carles, et al. · Open Archive Toulouse Archive Ouverte (University of Toulouse)
PDF
Works count: 15
Citation count: 148
H-index: 7
I10-index: 5
Year
Topic
Type