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Ken Gilleo
Observed names:
Dr. Ken Gilleo,
Gilleo, Ken,
K Gilleo,
K. Gilleo,
KEN GILLEO,
Ken Gilleo Phd
show all 6
Observed institution:
Institute of Electrical and Electronics Engineers
OpenAlex ID:
A5038487739
Assembly with Conductive Adhesives
1995
·
K. Gilleo
·
Soldering and Surface Mount Technology
·
96
Polymer Thick Film
1995
·
Ken Gilleo
·
40
Handbook of Flexible Circuits
1998
·
Ken Gilleo
·
36
Area Array Packaging Handbook: Manufacturing and Assembly
2001
·
Ken Gilleo
·
27
MEMS packaging issues and materials
2000
·
Ken Gilleo
·
IMAPSource Proceedings
·
25
Direct chip interconnect using polymer bonding
2003
·
K. Gilleo
·
IEEE Electronic Components and Technology Conference (ECTC)
·
18
Area Array Package Design
2003
·
Ken Gilleo
·
13
Photonics challenge to electronic packaging
2001
·
K. Gilleo
·
IEEE Transactions on Components and Packaging Technologies
·
13
Towards a better understanding of underfill encapsulation for flip chip technology: proposed developments for the future
1999
·
Ken Gilleo
, Matthew Witt
, et al.
·
Microelectronics International
·
12
Direct chip interconnect using polymer bonding
1990
·
K. Gilleo
·
IEEE Transactions on Components Hybrids and Manufacturing Technology
·
11
Area Array Packaging Processes: for BGA, Flip Chip, and CSP
2003
·
Ken Gilleo
·
10
Advances in Packaging and Assembly Polymers
1996
·
K. Gilleo
·
Microelectronics International
·
10
Area bonding conductive epoxy adhesive preforms for grid array and MCM substrate attach
2002
·
J.C. Bolger
, K. Gilleo
·
IEEE Multi-Chip Module Conference
·
9
Overview of new packages, materials and processes
2002
·
K. Gilleo
·
International Symposium on Advanced Packaging Materials
·
9
Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications
1999
·
Ken Gilleo
, Peter Ongley
·
Microelectronics International
·
9
Polymer thick film technology
1996
·
Ken Gilleo
·
P2 Pollution Prevention Review
·
9
MEMS and MOEMS Packaging Challenges
2000
·
KEN GILLEO
·
Journal of Materials Processing & Manufacturing Science
·
7
Low ball BGA: a new concept in thermoplastic packaging
2004
·
K. Gilleo
, J. Belmonte
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
6
High volume, low cost flip chip assembly on polyester flex
1999
·
Ken Gilleo
, Bob Boyes
, et al.
·
Circuit World
·
6
The Great Underfill Race
1998
·
Ken Gilleo
, David Blumel
·
Microelectronics
·
6
Underfill encapsulant technology for flip chip assembly
2002
·
K. Gilleo
, G. Nicholls
, et al.
·
IEEE International Symposium on Polymeric Electronics Packaging (PEP)
·
5
MEMS/MOEMS packaging : concepts, designs, metarials, and processes
2005
·
Ken Gilleo
·
McGraw-Hill eBooks
·
4
Getters: micromolecular scavengers for packaging [MEMS]
2002
·
M. Previti
, K. Gilleo
·
International Symposium on Advanced Packaging Materials
·
4
Area Array Chip Carrier: SMT Package for Known Good Die
1993
·
Mike Loo
, Ken Gilleo
·
4
Rheology and Surface Chemistry
2005
·
K Gilleo
·
CRC Press eBooks
·
3
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Works count:
57
Citation count:
399
H-index:
10
I10-index:
12
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