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James W. VanGilder

Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center
2005 · James W. VanGilder, Roger R. Schmidt · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 107
Effect of rack modeling detail on the numerical results of a data center test cell
2008 · Xuanhang Zhang, James W. VanGilder, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 54
Equation-based object-oriented modeling and simulation of data center cooling systems
2019 · Yangyang Fu, Wangda Zuo, et al. · Energy and Buildings · 39
Strategies for data center temperature control during a cooling system outage
2014 · Mi Lin, Shuangquan Shao, et al. · Energy and Buildings · 39
Proposal for standard compact server model for transient data center simulations
2015 · Zachary M. Pardey, Dustin W. Demetriou, et al. · 30
Data Center Cooling Prediction Using Artificial Neural Network
2007 · Saurabh K. Shrivastava, James W. VanGilder, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 24
Optimization of cluster cooling performance for data centers
2008 · Saurabh K. Shrivastava, James W. VanGilder, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 13
Creating a Calibrated CFD Model of a Midsize Data Center
2015 · Zachary M. Pardey, James W. VanGilder, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 12
A Compact Cooling-System Model for Transient Data Center Simulations
2018 · James W. VanGilder, Christopher M. Healey, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 11
Cooling performance of ceiling-plenum-ducted containment systems in data centers
2014 · James W. VanGilder, Xuanhang Zhang · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 11
Experimental Measurement of Server Thermal Effectiveness for Compact Transient Data Center Models
2013 · James W. VanGilder, Zachary M. Pardey, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 11
A Compact Rack Model for Data Center CFD Modeling
2020 · James VanGilder, Yatharth Vaishnani, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 10
Further exploration of a compact transient server model
2014 · Zachary M. Pardey, James W. VanGilder · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 10
Real-Time Data Center Transient Analysis
2011 · Xuanhang Simon Zhang, James W. VanGilder · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 10
Compact modeling of data center raised-floor-plenum stanchions: Pressure drop through sparse tube bundles
2016 · James W. VanGilder, Zachary M. Pardey, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 9
A Flow-Network Model for Predicting Rack Cooling in Containment Systems
2009 · Saurabh K. Shrivastava, James W. VanGilder · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 9
A Hybrid Flow Network-CFD Method for Achieving Any Desired Flow Partitioning Through Floor Tiles of a Raised-Floor Data Center
2003 · James W. VanGilder, Ted Lee · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 9
Potential-Flow Modeling for Data Center Applications
2011 · Christopher M. Healey, James W. VanGilder, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 8
Partially Decoupled Aisle Method for Estimating Rack-Cooling Performance in Near-Real Time
2007 · James W. VanGilder, Xuanhang Zhang, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 8
Compact Modeling of Data Center Air Containment Systems
2013 · Xuanhang (Simon) Zhang, James W. VanGilder, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 7
The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow
2011 · James W. VanGilder, Zachary R. Sheffer, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 7
A Real-Time Data Center Airflow and Energy Assessment Tool
2009 · Xuanhang Simon Zhang, James W. VanGilder, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 7
Transient Data Center Temperatures After a Primary Power Outage
2018 · Christopher M. Healey, James W. VanGilder, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 6
Perforated Tile Airflow Prediction: A Comparison of RANS CFD, Fast Fluid Dynamics, and Potential Flow Modeling
2015 · Christopher M. Healey, James W. VanGilder, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 4
A method for predicting key data center temperatures by known airflow streams
2012 · Christopher M. Healey, James W. VanGilder, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 4
Works count: 41
Citation count: 480
H-index: 11
I10-index: 14
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