Author

Louie Huang

Institution: Advanced Semiconductor Engineering (Taiwan)

Observed institution: Advanced Semiconductor Engineering (Taiwan)

OpenAlex ID: A5048576828

An evaluation of effects of molding compound properties on reliability of Cu wire components

2011 · Peng Su, Hidetoshi Seki, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 61

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

2016 · Ying-Ta Chiu, Tzu-Hsing Chiang, et al. · International Conference on Electronics Packaging (ICEP) · 14

Three years of fine Cu wire bonding in high volume manufacturing

2011 · Bernd K. Appelt, Louie Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 14

An evaluation of effects of molding compound and substrate material properties on reliability of Cu wire BGA components

2012 · Peng Su, Hidetoshi Seki, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13

Is copper wire bonding ready for automotive applications?

2011 · Bernd K. Appelt, Andy Tseng, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 13

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

2014 · Ying-Ta Chiu, Tzu-Hsing Chiang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9

Effects of reliability testing methods on microstructure and strength at the Cu wire-Al pad interface

2013 · Peng Su, Hidetoshi Seki, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9

Indium-Incorporation with InxGa1-xN Layers on GaN-Microdisks by Plasma-Assisted Molecular Beam Epitaxy

2019 · ChengDa Tsai, Ikai Lo, et al. · Crystals · 6

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The intermetallic compound (IMC) growth and phase identification of different kinds of copper wire and Al pad thickness

2015 · Stuwart Fan, Louie Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4

Mold array package for POP applications

2008 · Aching Lee, Louie Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

BGA assembly process development for 45nm ELK CUP devices

2008 · Andy Tseng, Bryan Lin, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Anisotropic Strain on GaN Microdisks Grown by Plasma-Assisted Molecular Beam Epitaxy

2020 · Hong-Yi Yang, Ikai Lo, et al. · Crystals · 2

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Bondability and challenges of Cu ultra-fine-wire bonding

2014 · Sylvia Sutiono, Zhang Xi, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Path Planning Mobile Robotics

2005 · Nsf Summer, Louie Huang, et al. · 2

Workability and reliability assessment of various high bandwidth PoP structures

2014 · Mike Hung, Louie Huang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1

Cu wire bonding knows no limit - 28 nm is qualified

2012 · Bernd K Appelt, Andy Tseng, et al. · IEEE CPMT Symposium Japan (ICSJ) · 1

Study of Anisotropic Strain in Self-Assembled GaN Microdisks Grown by Molecular Beam Epitaxy

2023 · Ying-Chieh Wang, Hong-Yi Yang, et al. · Book Publisher International (a part of SCIENCEDOMAIN International)

Reliability of SAC 105 and SAC1205N under Drop Tests

2016 · Jia-Shen Lan, Stuwart Fan, et al. · IMAPSource Proceedings

Advanced QFN packaging with trace routing design

2014 · C.T. Lu, H.Y. Tsai, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference

Using Gslide Procedure to Assemble Multiple Graphs on One Single Page

2006 · Louie Huang

Works count: 20

Citation count: 157

H-index: 7

I10-index: 5