Author

Herman Oprins

Observed names: H. Oprins, Herman O'Prins, Oprins Herman, Oprins, H., Oprins, Herman, Oprins, Herman;

Institution: IMEC

Observed institutions: Aarhus University, Hot Disk (Sweden), IMEC, University of Virginia, Technical University of Denmark, KU Leuven

ORCID: 0000-0003-0680-4969

Observed ORCID: 0000-0003-0680-4969

OpenAlex ID: A5049476718

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

2010 · Geert Van der Plas, Paresh Limaye, et al. · IEEE Journal of Solid-State Circuits · 310

High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices

2019 · Tiwei Wei, Herman Oprins, et al. · IEEE Transactions on Power Electronics · 95

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Interconnect metals beyond copper: reliability challenges and opportunities

2018 · K. Croes, Ch. Adelmann, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 92

Improved Thermal Performance of AlGaN/GaN HEMTs by an Optimized Flip-Chip Design

2006 · J. Das, H. Oprins, et al. · IEEE Transactions on Electron Devices · 76

Selecting alternative metals for advanced interconnects

2024 · Jean-Philippe Soulié, Kiroubanand Sankaran, et al. · Journal of Applied Physics · 73

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

2019 · T.-W. Wei, H. Oprins, et al. · Applied Thermal Engineering · 64

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Design issues and considerations for low-cost 3D TSV IC technology

2010 · Geert Van der Plas, Paresh Limaye, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 62

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

2019 · T.W. Wei, H. Oprins, et al. · Applied Thermal Engineering · 59

Influence of Field-Plate Configuration on Power Dissipation and Temperature Profiles in AlGaN/GaN on Silicon HEMTs

2015 · Vice Sodan, Herman Oprins, et al. · IEEE Transactions on Electron Devices · 51

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

2019 · Tiwei Wei, Herman Oprins, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 50

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Thermal Modelling of Silicon Photonic Ring Modulator with Substrate Undercut

2022 · David Coenen, Herman Oprins, et al. · Journal of Lightwave Technology · 48

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Electromigration Activation Energies in Alternative Metal Interconnects

2019 · Sofie Beyne, Olalla Varela Pedreira, et al. · IEEE Transactions on Electron Devices · 44

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Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices

2018 · V. Sodan, S. Stoffels, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 37

High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler

2017 · T. Tiwei, H. Oprins, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 37

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Compact thermal modeling of hot spots in advanced 3D-stacked ICs

2009 · C. Torregiani, H. Oprins, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 37

Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets

2021 · Tiwei Wei, Herman Oprins, et al. · International Journal of Heat and Mass Transfer · 33

Thermal analysis of hot spots in advanced 3D-stacked structures

2009 · C. Torregiani, Bart Vandevelde, et al. · International Workshop on Thermal Investigations of ICs and Systems · 30

Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack

2012 · H. Oprins, V. O. Cherman, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 29

Temperature dependent electrical characteristics of through-si-via (TSV) interconnections

2010 · G. Katti, A. Mercha, et al. · IEEE International Interconnect Technology Conference (IITC) · 29

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

2020 · Tiwei Wei, Herman Oprins, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 28

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

2015 · Herman Oprins, Vladimir Cherman, et al. · Journal of Electronic Packaging · 28

Package level thermal analysis of backside power delivery network (BS-PDN) configurations

2022 · Herman Oprins, Jose Luis Ramirez Bohorquez, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 26

3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding

2020 · Herman Oprins, Vladimir Cherman, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 26

Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems

2019 · Tiwei Wei, Herman Oprins, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 26

Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models

2022 · David Coenen, Herman Oprins, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 24

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Works count: 170

Citation count: 2,507

H-index: 24

I10-index: 71