Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Kuo‐Shu Kao
Observed names:
K. S. Kao,
K.S. Kao,
Kuo Shu Kao,
Kuo-Shu Kao
Institutions:
ITRI International,
Industrial Technology Research Institute
Observed institutions:
ITRI International,
National Pingtung University of Science and Technology,
National Tsing Hua University,
Industrial Technology Research Institute
ORCID:
0009-0005-9458-7870
Observed ORCID:
0009-0005-9458-7870
OpenAlex ID:
A5050009510
Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model
2024
·
Hsien-Chie Cheng
, Ji-Yuan Syu
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
44
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
2011
·
Ching-Kuan Lee
, Tao-Chih Chang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
42
Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization
2011
·
Chau-Jie Zhan
, Jing-Ye Juang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
36
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
2012
·
Ching-Kuan Lee
, Tao-Chih Chang
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
33
Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
2012
·
Jing-Yao Chang
, Ren-Shin Cheng
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
33
Impact of high density TSVs on the assembly of 3D-ICs packaging
2012
·
C.C. Lee
, T.F. Yang
, et al.
·
Microelectronic Engineering
·
30
Investigation of pre-bending substrate design in packaging assembly of an IGBT power module
2013
·
Chang-Chun Lee
, Kuo-Shu Kao
, et al.
·
Microelectronic Engineering
·
26
Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP
2012
·
Chau-Jie Zhan
, Pei-Jer Tzeng
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
22
Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill
2012
·
Chang-Chun Lee
, Tsung-Fu Yang
, et al.
·
Microelectronic Engineering
·
20
Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film
2012
·
Chang-Chun Lee
, Tsung-Fu Yang
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
19
IGBT power module packaging for EV applications
2012
·
Chun-Kai Liu
, Yu-Lin Chao
, et al.
·
International Conference on Electronic Materials and Packaging
·
16
Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections
2012
·
Shin-Yi Huang
, Chau-Jie Zhan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
16
Reliability enhancements of chip-on-chip package with layout designs of microbumps
2013
·
Chang-Chun Lee
, Kuo-Shu Kao
, et al.
·
Microelectronic Engineering
·
14
Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration
2012
·
Ching-Kuan Lee
, Chau-Jie Zhan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging
2021
·
Chang-Chun Lee
, Kuo-Shu Kao
, et al.
·
Journal of Electronic Packaging
·
9
600V, 450A IGBT power module for 50kw electrical vehicle
2013
·
Chun-Kai
, Liu
, et al.
·
IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG)
·
9
Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer‐level underfill film
2012
·
Tsung‐Fu Yang
, Kuo‐Shu Kao
, et al.
·
Soldering and Surface Mount Technology
·
9
Achievement of low temperature chip stacking by a wafer-applied underfill material
2011
·
Ren-Shin Cheng
, Kuo-Shu Kao
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections
2012
·
Yu-Min Lin
, Chau-Jie Zhan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules
2024
·
Chang-Chun Lee
, Kuo-Shu Kao
, et al.
·
IEEE Transactions on Power Electronics
·
7
Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate
2021
·
Chang-Chun Lee
, Kuo-Shu Kao
, et al.
·
Journal of Electronic Packaging
·
7
Fatigue life of a microcantilever beam in bending
2004
·
H. Hocheng
, K. S. Kao
, et al.
·
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena
·
7
Development of packaging technologies for SiC power module
2015
·
Chun-Kai Liu
, Yu-Lin Chao
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
6
Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding
2011
·
Tao-Chih Chang
, Ren-Shin Cheng
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Fine pitch “NCF-type compliant-bumped COG”
2007
·
Chao-Chyun An
, Shyh-Ming Chang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Show more works
View as search
Works count:
51
Citation count:
475
H-index:
13
I10-index:
14
Year
Topic
Type
