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Author

Leon van Dijk

Observed name: L. van Dijk
Institution: ASML (Netherlands)
OpenAlex ID: A5053648359
Wafer-shape based in-plane distortion predictions using Superfast 4G metrology
2017 · Leon van Dijk, Jeffrey Mileham, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 32
Extreme Sensitivity of Circular Dichroism to Long-Range Excitonic Couplings in Helical Supramolecular Assemblies
2009 · Leon van Dijk, Peter A. Bobbert, et al. · The Journal of Physical Chemistry B · 31
Intra-field stress impact on global wafer deformation
2019 · Richard J. F. van Haren, Ronald Otten, et al. · Metrology, Inspection, and Process Control XXXVI · 29
Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding
2024 · Richard J. F. van Haren, Suwen Li, et al. · SPIE Novel Patterning Technologies · 13
Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations
2023 · Richard J. F. van Haren, Suwen Li, et al. · Metrology, Inspection, and Process Control XXXVI · 11
Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches
2024 · Karine Abadie, Ivanie Mendes, et al. · IEEE International Interconnect Technology Conference (IITC) · 10
Off-line mask-to-mask registration characterization as enabler for computational overlay
2017 · Dirk Beyer, Richard J. F. van Haren, et al. · SPIE Photomask Technology Conference · 9
Excursion detection and root-cause analysis using virtual overlay metrology
2021 · Leon van Dijk, Kedir M. Adal, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 6
The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
2019 · Richard J. van Haren, Steffen Steinert, et al. · Photomask and next-generation lithography mask technology. Conference · 6
Wafer edge overlay control solution for N7 and beyond
2018 · Richard J. F. van Haren, Jan Hermans, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 6
New technique for measuring free-form wafer shape for feed-forward overlay corrections
2023 · Kiril I. Kurteva, Guillermo Castro Luis, et al. · International Conference on Extreme Ultraviolet Lithography · 5
The mask contribution as part of the intra-field on-product overlay performance
2020 · Richard van Haren, Steffen Steinert, et al. · SPIE Photomask Technology Conference · 5
Smart implant-layer overlay metrology to enable fab cycle time reduction
2019 · Leon van Dijk, Faegheh Hasibi, et al. · Metrology, Inspection, and Process Control XXXVI · 5
Towards fab cycle time reduction by machine learning-based overlay metrology
2018 · Leon van Dijk, Auguste Lam, et al. · European Mask and Lithography Conference (EMLC) · 4
Track integrated backside cleaning solution: impact of backside contamination on printing distortions
2023 · Andreia Santos, Wesley Zanders, et al. · Advances in Patterning Materials and Processes · 3
Die-level nano-topography metrology to characterize the stress-induced in-plane distortion contribution to overlay
2023 · Viorel Balan, Florent Michel, et al. · Metrology, Inspection, and Process Control XXXVI · 3
Direct correlation between mask registration and on-wafer measurements for individual logic device features
2022 · Richard J. F. van Haren, Steffen Steinert, et al. · SPIE Photomask Technology Conference · 3
Mitigation of the etch-induced intra-field overlay contribution
2022 · Richard J. F. van Haren, Oktay Yildirim, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 3
Intra-field etch induced overlay penalties
2020 · Richard van Haren, Oktay Yildirim, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 3
Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
2019 · Richard J. F. van Haren, Steffen Steinert, et al. · SPIE Photomask Technology Conference · 3
Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
2018 · Richard J. van Haren, Steffen Steinert, et al. · Photomask and next-generation lithography mask technology. Conference · 3
Focused ion beam machined nanostructures depth profiled by macrochannelling ion beam analysis
2006 · S.M. Orbons, L. van Dijk, et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 3
Macrochannelling: Characterisation of nano-structures by ion beam analysis
2005 · Leon van Dijk, Murat Bozkurt, et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 3
Characterization and mitigation of wafer bonding-induced distortions to enable the post-bonding lithography requirements of advanced nodes
2026 · Leon van Dijk, Andrew Tuchman, et al. · Metrology, Inspection, and Process Control XXXVI · 2
Integration and process strategies for post-bond lithographic overlay control for advanced node
2026 · Ilseok Son, Andrew Tuchman, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 1
Works count: 32
Citation count: 206
H-index: 7
I10-index: 6
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