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Author

Hirosuke Takamatsu

Observed name: Hirosuke Takamatsu Hirosuke Takamatsu
Institution: Ushio (Japan)
ORCID: 0000-0002-4044-017X
Observed ORCID: 0000-0002-4044-017X
OpenAlex ID: A5059064124
Synthesis of Amorphous Carbon Nitride Films Using Dissociative Excitation Reaction
2000 · Hidetoshi Saitoh Hidetoshi Saitoh, Hirosuke Takamatsu Hirosuke Takamatsu, et al. · Japanese Journal of Applied Physics · 48
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Mechanism of Nitrogen Incorporation into Amorphous-CNx Films Formed by Plasma-Enhanced Chemical-Vapor Deposition of the Doublet and Quartet States of the CN Radical
2000 · Haruhiko Ito Haruhiko Ito, Noriko Ito Noriko Ito, et al. · Japanese Journal of Applied Physics · 34
Deposition of thin and uniform photoresist on three-dimensional structures using fast flow in spray coating
2005 · Vijay Kumar Singh, Minoru Sasaki, et al. · Journal of Micromechanics and Microengineering · 33
Limitation of Nitrogen Incorporation into the Hydrogenated Amorphous Carbon Nitride Films Formed from the Dissociative Excitation Reaction of CH3CN
2001 · Haruhiko Ito Haruhiko Ito, Noriko Ito Noriko Ito, et al. · Japanese Journal of Applied Physics · 17
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First Demonstration of Stitching-Free Exposure over an Ultra-Large 18-Reticle Area with High-Resolution 1.5μm Line/Space on Glass Substrates
2026 · Naoya Sohara, Toshimitsu Arai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Investigation from the Lithography of the Possible of Forming Less Than 8 μm Pitch Required for Advanced Packaging
2025 · Yu Abe, Naoya Sohara, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 1
Development of panel-level organic lithography equipment for advanced packaging
2024 · Naoya Sohara, Yu Abe, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 1
Verification of resolution considering process margins for the l0μm pitch patterning of organic substrates
2024 · Naoya Sohara, Yu Abe, et al. · International Conference on Electronics Packaging (ICEP)
Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
2023 · Shinichi Endo, Akihiro Shimizu, et al. · ECS Meeting Abstracts
Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
2023 · Shinichi Endo, Akihiro Shimizu, et al. · ECS Transactions
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Investigating the fine line lithography process on the large-size organic panels for advanced packaging and development
2020 · Naoya Sohara, Ryotaro Takahashi, et al. · SPIE Optical Microlithography
Works count: 11
Citation count: 136
H-index: 4
I10-index: 4
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