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J. Bisschop
Observed names:
Bisschop, J.,
Bisschop, Jaap,
J Bisschop,
Jaap Bisschop
Observed institutions:
NXP (Netherlands),
University of Groningen,
Philips (Netherlands),
Signify (Netherlands),
Eindhoven University of Technology
OpenAlex ID:
A5060056829
The physics of SiO2layers
1990
·
J F Verwey
, E A Amerasekera
, et al.
·
Reports on Progress in Physics
·
72
The Relation Between Degradation Under DC and RF Stress Conditions
2011
·
Andries J. Scholten
, Daniel Stephens
, et al.
·
IEEE Transactions on Electron Devices
·
40
Effect of thermal gradients on the electromigration life-time in power electronics
2004
·
H.V. Nguyen
, C. Salm
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
34
Vertical die crack stresses of Flip Chip induced in major package assembly processes
2000
·
D.G. Yang
, L.J. Ernst
, et al.
·
Microelectronics Reliability
·
26
Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling
2002
·
H.V. Nguyen
, C. Salm
, et al.
·
Microelectronics Reliability
·
23
Temperature dependence of concentrations and mobilities in thin bismuth films
1983
·
A.H. de Kuijper
, J. Bisschop
·
Thin Solid Films
·
19
Reliability of integrated resistors and the influence of WLCSP bake
2016
·
S. Jose
, J. Bisschop
, et al.
·
IEEE International Integrated Reliability Workshop final report
·
15
The hot carrier degradation rate under AC stress
2010
·
Guido T. Sasse
, Jaap Bisschop
·
IEEE International Reliability Physics Symposium proceedings
·
14
Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques
2004
·
R.B.R. van Silfhout
, W.D. van Driel
, et al.
·
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
·
14
Simulating NBTI Degradation in Arbitrary Stressed Analog/ Mixed-Signal Environments
2015
·
Jinbo Wan
, Hans G. Kerkhoff
, et al.
·
IEEE Transactions on Nanotechnology
·
13
Reliability methods and standards
2007
·
J. Bisschop
·
Microelectronics Reliability
·
13
State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes
2001
·
R.B.R. van Silfhout
, Y. Li
, et al.
·
University of Twente Research Information
·
12
Experimental temperature dependence of fluctuations in germanium and silicon
1983
·
J. Bisschop
, J.L. Cuijpers
·
Physica B+C
·
11
Fast Thermal Cycling-Enhanced Electromigration in Power Metallization
2004
·
H.V. Nguyen
, C. Salm
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
10
PDF
Metal contamination characterization in CCD image sensors
2002
·
W.J. Toren
, J. Bisschop
·
Technical digest - International Electron Devices Meeting/Technical digest
·
10
A model for the electrical conduction in polysilicon oxide
1986
·
J. Bisschop
, E.J. Korma
, et al.
·
IEEE Transactions on Electron Devices
·
10
Radial distribution functions of liquid Na and Cs
1978
·
T. Lee
, J. Bisschop
, et al.
·
Physica B+C
·
10
Test chip for detecting thin film cracking induced by fast temperature cycling and electromigration in multilevel interconnect systems
2003
·
H.V. Nguyen
, C. Salm
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
7
Temperature dependence of 1/f noise in thin bismuth films
1984
·
J. Bisschop
, A. H. de Kuijper
·
Journal of Applied Physics
·
6
Reliability Simulation Models for Hot Carrier Degradation
2014
·
A. J. Scholten
, B. De Vries
, et al.
·
Springer eBooks
·
5
On intrinsic failure rate of products with error correction
2006
·
Guoqiao Tao
, J. Bisschop
, et al.
·
IEEE International Integrated Reliability Workshop final report
·
5
A Reliability Model for interlayer dielectrics cracking during very fast thermal cycling
2003
·
Văn Hiếu Nguyễn
, Cora Salm
, et al.
·
University of Twente Research Information
·
5
Determination of the stress level for voltage screen of integrated circuits
2010
·
R.M. Kho
, A.J. Moonen
, et al.
·
Microelectronics Reliability
·
4
On the noise parameter α in degenerate semiconductors and metals
1985
·
T.G.M. Kleinpenning
, J. Bisschop
·
Physica B+C
·
4
Fast thermal cycling stress and degredation in multilayer interconnects
2001
·
Nguyễn Văn Hiếu
, Cora Salm
, et al.
·
3
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Works count:
38
Citation count:
394
H-index:
12
I10-index:
17
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